Shi Qi Huang

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,462,503
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 11,348,936
- Issue date May 31, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 11,342,352
- Issue date May 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local word line driver device, memory device, and fabrication metho...
- Patent number 11,270,770
- Issue date Mar 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Cheng Gan
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 11,205,619
- Issue date Dec 21, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 11,094,714
- Issue date Aug 17, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,049,834
- Issue date Jun 29, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 10,833,042
- Issue date Nov 10, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 10,748,851
- Issue date Aug 18, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20210343742
- Publication date Nov 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL WORD LINE DRIVER DEVICE, MEMORY DEVICE, AND FABRICATION METHO...
- Publication number 20210166762
- Publication date Jun 3, 2021
- Yangtze Memory Technologies Co., Ltd.
- Cheng GAN
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20210035888
- Publication date Feb 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20210036006
- Publication date Feb 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20210035887
- Publication date Feb 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20210035941
- Publication date Feb 4, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200335450
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200243455
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20200243473
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Shi Qi Huang

Person

Patents Grantslast 30 patents

Hybrid bonding using dummy bonding contacts

Three-dimensional memory devices and fabricating methods thereof

Three-dimensional memory devices and fabricating methods thereof

Local word line driver device, memory device, and fabrication metho...

Hybrid bonding using dummy bonding contacts and dummy interconnects

Three-dimensional memory devices and fabricating methods thereof

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts and dummy interconnects

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

LOCAL WORD LINE DRIVER DEVICE, MEMORY DEVICE, AND FABRICATION METHO...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

HYBRID BONDING USING DUMMY BONDING CONTACTS

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

HYBRID BONDING USING DUMMY BONDING CONTACTS