Shi-Wei Lee

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Submount with cavities and through vias for LED packaging
- Patent number 9,431,592
- Issue date Aug 30, 2016
- The Hong Kong University of Science and Technology
- Shi-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having an embedded 3D hybrid integration for optoelectron...
- Patent number 9,057,853
- Issue date Jun 16, 2015
- The Hong Kong University of Science and Technology
- Hon Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus having thermal-enhanced and cost-effective 3D IC integrat...
- Patent number 8,604,603
- Issue date Dec 10, 2013
- The Hong Kong University of Science and Technology
- Hon Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBMOUNT WITH CAVITIES AND THROUGH VIAS FOR LED PACKAGING
- Publication number 20140110728
- Publication date Apr 24, 2014
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Shi-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus having thermal-enhanced and cost-effective 3D IC integrat...
- Publication number 20100213600
- Publication date Aug 26, 2010
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Hon Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus Having an Embedded 3D Hybrid Integration for Optoelectron...
- Publication number 20100215314
- Publication date Aug 26, 2010
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Hon Shing Lau
- G02 - OPTICS