Shiang-Chi Lin

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic sensor system and multi-layer stiffener for foldable dis...
- Patent number 11,910,716
- Issue date Feb 20, 2024
- QUALCOMM Incorporated
- Chin-Jen Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Under-display ultrasonic fingerprint sensors for foldable displays
- Patent number 11,798,307
- Issue date Oct 24, 2023
- QUALCOMM Incorporated
- Shiang-Chi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
MEMS structure and manufacturing method thereof
- Patent number 11,505,454
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kang-Che Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor manufacturing method and structure thereof
- Patent number 11,254,564
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 11,148,936
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure including heater
- Patent number 10,618,804
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 10,508,027
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 10,046,965
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,035,700
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter electrode to improve vacuum level in a microelectromechanica...
- Patent number 9,938,134
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Chi Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensing structure
- Patent number 9,630,831
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,567,209
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gas sensor, integrated circuit device using the same, and manufactu...
- Patent number 9,459,224
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICES CONFIGURED FOR NEAR-FIELD ULTRASONIC IMAGING
- Publication number 20240338964
- Publication date Oct 10, 2024
- QUALCOMM Incorporated
- Shiang-Chi LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS
- Publication number 20240037979
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Shiang-Chi LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS
- Publication number 20230252816
- Publication date Aug 10, 2023
- QUALCOMM Incorporated
- Shiang-Chi LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS
- Publication number 20230063693
- Publication date Mar 2, 2023
- QUALCOMM Incorporated
- Shiang-Chi LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210087056
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- KANG-CHE HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20200231431
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200140266
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180362335
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20180346319
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER ELECTRODE TO IMPROVE VACUUM LEVEL IN A MICROELECTROMECHANICA...
- Publication number 20170297904
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shiang-Chi Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20170183222
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170129771
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SENSING STRUCTURE
- Publication number 20170107099
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170066646
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Shiang-Chi Lin

Person

Patents Grantslast 30 patents

Ultrasonic sensor system and multi-layer stiffener for foldable dis...

Under-display ultrasonic fingerprint sensors for foldable displays

MEMS structure and manufacturing method thereof

Semiconductor manufacturing method and structure thereof

CMOS-MEMS structure and method of forming the same

Manufacturing method of semiconductor structure including heater

CMOS-MEMS structure and method of forming the same

CMOS-MEMS structure and method of forming the same

Semiconductor structure and manufacturing method thereof

Getter electrode to improve vacuum level in a microelectromechanica...

Semiconductor sensing structure

Semiconductor structure and manufacturing method thereof

Gas sensor, integrated circuit device using the same, and manufactu...

Patents Applicationslast 30 patents

DEVICES CONFIGURED FOR NEAR-FIELD ULTRASONIC IMAGING

UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS

UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS

UNDER-DISPLAY ULTRASONIC FINGERPRINT SENSORS FOR FOLDABLE DISPLAYS

MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MANUFACTURING METHOD

GETTER ELECTRODE TO IMPROVE VACUUM LEVEL IN A MICROELECTROMECHANICA...

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR SENSING STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF