Shiann-Ming LIOU

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging-level chip and chip module packaged with magnetic cover,...
- Patent number 11,769,708
- Issue date Sep 26, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solid-State Drive with Detachable Capacitor Housing Portion
- Publication number 20230359253
- Publication date Nov 9, 2023
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING-LEVEL CHIP AND CHIP MODULE PACKAGED WITH MAGNETIC COVER,...
- Publication number 20220270951
- Publication date Aug 25, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Circuit Board
- Publication number 20220217851
- Publication date Jul 7, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR