Shibaek Nam

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Puchon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package and method for making the same
- Publication number 20070001278
- Publication date Jan 4, 2007
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having multi-chip package structure
- Publication number 20030122236
- Publication date Jul 3, 2003
- Shibaek Nam
- H01 - BASIC ELECTRIC ELEMENTS