Shiban K. Tiku

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Moisture barrier for bond pads and integrated circuit having the same
- Patent number 11,830,826
- Issue date Nov 28, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making moisture barrier for bond pads and integrated circ...
- Patent number 11,387,193
- Issue date Jul 12, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for bond pads and integrated circuit having the same
- Patent number 11,222,855
- Issue date Jan 11, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure with refractory metal barrier
- Patent number 9,735,249
- Issue date Aug 15, 2017
- Skyworks Solutions, Inc.
- Shiban Kishan Tiku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Refractory metal barrier in semiconductor devices
- Patent number 9,422,621
- Issue date Aug 23, 2016
- Skyworks Solutions, Inc.
- Shiban Kishan Tiku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of evaporating metal onto a semiconductor wafer in a test w...
- Patent number 8,481,344
- Issue date Jul 9, 2013
- Skyworks Solutions, Inc.
- Lam T. Luu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for uniform metal plating
- Patent number 8,415,770
- Issue date Apr 9, 2013
- Skyworks Solutions, Inc.
- Jens A. Riege
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for uniform metal plating
- Patent number 8,188,575
- Issue date May 29, 2012
- Skyworks Solutions, Inc.
- Jens A. Riege
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and methods for evaporation including test wafer holder
- Patent number 8,022,448
- Issue date Sep 20, 2011
- Skyworks Solutions, Inc.
- Lam T. Luu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallization of a semiconductor substrate and related s...
- Patent number 6,614,117
- Issue date Sep 2, 2003
- Skyworks Solutions, Inc.
- Shiban K. Tiku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallization of a semiconductor substrate
- Patent number 6,596,635
- Issue date Jul 22, 2003
- Skyworks Solutions, Inc.
- Shiban K. Tiku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for outdiffusion of zinc into III-V substrates using zinc tu...
- Patent number 4,843,033
- Issue date Jun 27, 1989
- Texas Instruments Incorporated
- Donald L. Plumton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor and method
- Patent number 4,760,369
- Issue date Jul 26, 1988
- Texas Instruments Incorporated
- Shiban K. Tiku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar heterojunction bipolar device and method
- Patent number 4,672,414
- Issue date Jun 9, 1987
- Texas Instruments Incorporated
- Nancy J. S. Gabriel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making Schottky barrier devices formed by diffusion befo...
- Patent number 4,632,713
- Issue date Dec 30, 1986
- Texas Instruments Incorporated
- Shiban K. Tiku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite dielectrics for low voltage electroluminescent displays
- Patent number 4,482,841
- Issue date Nov 13, 1984
- Texas Instruments Incorporated
- Shiban K. Tiku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME
- Publication number 20220328428
- Publication date Oct 13, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRC...
- Publication number 20210118820
- Publication date Apr 22, 2021
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MOISTURE BARRIER FOR METAL INSULATOR METAL CAPAC...
- Publication number 20210118821
- Publication date Apr 22, 2021
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME
- Publication number 20210074652
- Publication date Mar 11, 2021
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR METAL INSULATOR METAL CAPACITORS AND INTEGRATE...
- Publication number 20210020587
- Publication date Jan 21, 2021
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURE WITH REFRACTORY METAL BARRIER
- Publication number 20160329410
- Publication date Nov 10, 2016
- SKYWORKS SOLUTIONS, INC.
- Shiban Kishan TIKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, DEVICES AND METHODS RELATED TO REACTIVE EVAPORATION OF REF...
- Publication number 20150152543
- Publication date Jun 4, 2015
- SKYWORKS SOLUTIONS, INC.
- Shiban Kishan TIKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REFRACTORY METAL BARRIER IN SEMICONDUCTOR DEVICES
- Publication number 20150123169
- Publication date May 7, 2015
- SKYWORKS SOLUTIONS, INC.
- Shiban Kishan TIKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR UNIFORM METAL PLATING
- Publication number 20120211888
- Publication date Aug 23, 2012
- SKYWORKS SOLUTIONS, INC.
- Jens A. Riege
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF EVAPORATING METAL ONTO A SEMICONDUCTOR WAFER IN A TEST W...
- Publication number 20120083118
- Publication date Apr 5, 2012
- SKYWORKS SOLUTIONS, INC.
- Lam T. Luu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR UNIFORM METAL PLATING
- Publication number 20120080790
- Publication date Apr 5, 2012
- SKYWORKS SOLUTIONS, INC.
- Jens A. Riege
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shiban K. Tiku

Person

Patents Grantslast 30 patents

Moisture barrier for bond pads and integrated circuit having the same

Method of making moisture barrier for bond pads and integrated circ...

Moisture barrier for bond pads and integrated circuit having the same

Gate structure with refractory metal barrier

Refractory metal barrier in semiconductor devices

Methods of evaporating metal onto a semiconductor wafer in a test w...

Apparatus and methods for uniform metal plating

Apparatus and method for uniform metal plating

Apparatus and methods for evaporation including test wafer holder

Method for metallization of a semiconductor substrate and related s...

Method for metallization of a semiconductor substrate

Method for outdiffusion of zinc into III-V substrates using zinc tu...

Thin film resistor and method

Planar heterojunction bipolar device and method

Process of making Schottky barrier devices formed by diffusion befo...

Composite dielectrics for low voltage electroluminescent displays

Patents Applicationslast 30 patents

MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME

METHOD OF MAKING MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRC...

METHOD OF MAKING A MOISTURE BARRIER FOR METAL INSULATOR METAL CAPAC...

MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME

MOISTURE BARRIER FOR METAL INSULATOR METAL CAPACITORS AND INTEGRATE...

GATE STRUCTURE WITH REFRACTORY METAL BARRIER

SYSTEMS, DEVICES AND METHODS RELATED TO REACTIVE EVAPORATION OF REF...

REFRACTORY METAL BARRIER IN SEMICONDUCTOR DEVICES

APPARATUS AND METHODS FOR UNIFORM METAL PLATING

METHODS OF EVAPORATING METAL ONTO A SEMICONDUCTOR WAFER IN A TEST W...

APPARATUS AND METHOD FOR UNIFORM METAL PLATING