Shigeaki Yagi

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, semiconductor device using the composition an...
- Patent number 5,844,309
- Issue date Dec 1, 1998
- Fujitsu Limited
- Yukio Takigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor
- Patent number 5,763,540
- Issue date Jun 9, 1998
- Fujitsu Limited
- Yoshihiro Nakata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition
- Patent number 5,659,004
- Issue date Aug 19, 1997
- Fujitsu Limited
- Yukio Takigawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...