Shigefumi Okada

Follow

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress-resilient chip structure and dicing process
- Patent number 10,211,175
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing employing edge region underfill removal
- Patent number 8,652,941
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20150001714
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20140151879
- Publication date Jun 5, 2014
- Disco Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
- Publication number 20130149841
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS