Shigeharu Arike

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Micro fluid system support and manufacturing method thereof
- Patent number 8,889,084
- Issue date Nov 18, 2014
- Hitachi Chemical Company, Ltd.
- Hiroshi Kawazoe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro fluid system support and manufacturing method thereof
- Patent number 8,865,090
- Issue date Oct 21, 2014
- Hitachi Chemical Co., Ltd.
- Hiroshi Kawazoe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for surface treatment of copper and copper
- Patent number 8,809,696
- Issue date Aug 19, 2014
- Hitachi Chemical Company, Ltd.
- Tomoaki Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Connecting terminal, semiconductor package using connecting termina...
- Patent number 8,426,742
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Connection board, and multi-layer wiring board, substrate for semic...
- Patent number 8,028,402
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of insulating varnishes and multilayer printed circuit b...
- Patent number 6,197,149
- Issue date Mar 6, 2001
- Hitachi Chemical Company, Ltd.
- Kazuhito Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multiple wire printed circuit board and process for making the same
- Patent number 6,042,685
- Issue date Mar 28, 2000
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple wire printed circuit board and process for making the same
- Patent number 5,928,757
- Issue date Jul 27, 1999
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multilayer printed circuit board
- Patent number 5,690,837
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 5,688,408
- Issue date Nov 18, 1997
- Hitachi Chemical Company Ltd.
- Yoshiyuki Tsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multiple wire wiring board
- Patent number 5,584,121
- Issue date Dec 17, 1996
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer printed wiring board
- Patent number 5,562,971
- Issue date Oct 8, 1996
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple wire adhesive on a multiple wire wiring board
- Patent number 5,486,655
- Issue date Jan 23, 1996
- Hitachi Chemical Co., Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...
- Patent number 5,403,869
- Issue date Apr 4, 1995
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing coaxial conductor interconnection wiring board
- Patent number 5,323,534
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial conductor interconnection wiring board
- Patent number 5,233,133
- Issue date Aug 3, 1993
- Hitachi Chemical Company Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER
- Publication number 20110147072
- Publication date Jun 23, 2011
- Tomoaki Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20110036479
- Publication date Feb 17, 2011
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINA...
- Publication number 20100071940
- Publication date Mar 25, 2010
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274582
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274581
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274583
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274585
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274586
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090274584
- Publication date Nov 5, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF
- Publication number 20090269245
- Publication date Oct 29, 2009
- HITACHI CHEMICAL CO., Ltd.
- Hiroshi KAWAZOE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Connection board, and multi-layer wiring board, substrate for semic...
- Publication number 20090008141
- Publication date Jan 8, 2009
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080289868
- Publication date Nov 27, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080010819
- Publication date Jan 17, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection substrate, multi-layer wiring board using the connection...
- Publication number 20060162956
- Publication date Jul 27, 2006
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro fluid system support and manufacturing method thereof
- Publication number 20050249637
- Publication date Nov 10, 2005
- Hiroshi Kawazoe
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Shigeharu Arike

Person

Patents Grantslast 30 patents

Micro fluid system support and manufacturing method thereof

Micro fluid system support and manufacturing method thereof

Method for surface treatment of copper and copper

Connecting terminal, semiconductor package using connecting termina...

Connection board, and multi-layer wiring board, substrate for semic...

Production of insulating varnishes and multilayer printed circuit b...

Multiple wire printed circuit board and process for making the same

Multiple wire printed circuit board and process for making the same

Process for producing multilayer printed circuit board for wire bon...

Process for producing multilayer printed circuit board

Multilayer printed wiring board

Process for producing multiple wire wiring board

Multilayer printed wiring board

Multiple wire adhesive on a multiple wire wiring board

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...

Process for producing coaxial conductor interconnection wiring board

Coaxial conductor interconnection wiring board

Patents Applicationslast 30 patents

METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINA...

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

Connection board, and multi-layer wiring board, substrate for semic...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

Connection substrate, multi-layer wiring board using the connection...

Micro fluid system support and manufacturing method thereof