Shigeharu Takahagi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and process for producing the same
- Patent number 7,217,370
- Issue date May 15, 2007
- Hitachi Cable, Ltd.
- Hiroshi Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and process for producing the same
- Patent number 6,924,987
- Issue date Aug 2, 2005
- Hitachi Cable, Ltd.
- Hiroshi Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number RE37323
- Issue date Aug 14, 2001
- Hitachi Cable Ltd.
- Toshio Kawamura
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number 5,635,009
- Issue date Jun 3, 1997
- Hitachi Cable Ltd.
- Toshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring board and process for producing the same
- Publication number 20050205516
- Publication date Sep 22, 2005
- HITACHI CABLE, LTD.
- Hiroshi Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and process for producing the same
- Publication number 20030043556
- Publication date Mar 6, 2003
- HITACHI CABLE, LTD.
- Hiroshi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS