Shigeji Kuroda

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Automatic semiconductor wafer applying apparatus
- Patent number 6,249,943
- Issue date Jun 26, 2001
- Nitto Denko Corporation
- Takao Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist removing apparatus and method
- Patent number 6,235,144
- Issue date May 22, 2001
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resist removing method
- Patent number 6,099,675
- Issue date Aug 8, 2000
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for peeling protective adhesive tape from semi...
- Patent number 5,891,298
- Issue date Apr 6, 1999
- Nitto Denko Corporation
- Shigeji Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing system
- Patent number 5,246,524
- Issue date Sep 21, 1993
- Nitto Denko Corporation
- Shigeji Kuroda
- H01 - BASIC ELECTRIC ELEMENTS