Shigeki Harada

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a metallization layer structure
- Patent number 5,096,749
- Issue date Mar 17, 1992
- Fujitsu Limited
- Shigeki Harada
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic package type semiconductor device and method of assembling...
- Patent number 5,081,067
- Issue date Jan 14, 1992
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 5,065,223
- Issue date Nov 12, 1991
- Fujitsu VLSI Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package type semiconductor device and method of assembling...
- Patent number 5,055,914
- Issue date Oct 8, 1991
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization layer structure formed on aluminum nitride ceramics a...
- Patent number 4,980,239
- Issue date Dec 25, 1990
- Fujitsu Limited
- Shigeki Harada
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor device and method of producing semiconductor device
- Patent number 4,742,024
- Issue date May 3, 1988
- Fujitsu Limited
- Masahiro Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink package for flip-chip IC
- Patent number 4,698,663
- Issue date Oct 6, 1987
- Fujitsu Limited
- Masahiro Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS

Shigeki Harada

Person

Patents Grantslast 30 patents

Method of producing a metallization layer structure

Ceramic package type semiconductor device and method of assembling...

Packaged semiconductor device

Ceramic package type semiconductor device and method of assembling...

Metallization layer structure formed on aluminum nitride ceramics a...

Semiconductor device and method of producing semiconductor device

Heatsink package for flip-chip IC