Shigeki Kondo

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Tochigi-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Core ball, solder paste, formed-solder, flux-coated core ball and s...
- Patent number 9,278,409
- Issue date Mar 8, 2016
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Core Material, Semiconductor Package, and Forming Method of Bump El...
- Publication number 20180174991
- Publication date Jun 21, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki Nishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...
- Publication number 20180015572
- Publication date Jan 18, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...