Shigeki Morioka

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Kokubu, JP

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Patents Grantslast 30 patents

Information Patent Grant
High-frequency module coupled via aperture in a ground plane
- Patent number 6,356,173
- Issue date Mar 12, 2002
- Kyocera Corporation
- Koichi Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for mounting a high-frequency package
- Patent number 6,057,600
- Issue date May 2, 2000
- Kyocera Corporation
- Kenji Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS