Shigeki SAKAGUCHI

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat insulating sheet and method of manufacturing thereof, and elec...
- Patent number 12,195,911
- Issue date Jan 14, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuma Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conductor and device including the same
- Patent number 9,746,259
- Issue date Aug 29, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Tanaka
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonding material, electronic component, bonding structure and elect...
- Patent number 8,227,090
- Issue date Jul 24, 2012
- Panasonic Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,917,118
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kouji Omori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT INSULATING SHEET AND METHOD OF MANUFACTURING THEREOF, AND ELEC...
- Publication number 20200378058
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUMA OIKAWA
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
BONDING MATERIAL, BONDED BODY OBTAINED BY THE SAME, AND MANUFACTURI...
- Publication number 20180154612
- Publication date Jun 7, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIDETOSHI KITAURA
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT CONDUCTOR AND DEVICE INCLUDING THE SAME
- Publication number 20150330724
- Publication date Nov 19, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi TANAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE
- Publication number 20100294550
- Publication date Nov 25, 2010
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECT...
- Publication number 20090242249
- Publication date Oct 1, 2009
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040089945
- Publication date May 13, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kouji Omori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shigeki SAKAGUCHI

Person

Patents Grantslast 30 patents

Heat insulating sheet and method of manufacturing thereof, and elec...

Heat conductor and device including the same

Bonding material, electronic component, bonding structure and elect...

Semiconductor device

Patents Applicationslast 30 patents

HEAT INSULATING SHEET AND METHOD OF MANUFACTURING THEREOF, AND ELEC...

BONDING MATERIAL, BONDED BODY OBTAINED BY THE SAME, AND MANUFACTURI...

HEAT CONDUCTOR AND DEVICE INCLUDING THE SAME

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECT...

Semiconductor device