Shigeki Sawa

Person

  • Gifu, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of manufacturing a printed wiring board

    • Patent number 8,832,935
    • Issue date Sep 16, 2014
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Plating apparatus and plating method

    • Patent number 8,721,863
    • Issue date May 13, 2014
    • Ibiden Co., Ltd.
    • Yasuaki Tachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 8,624,132
    • Issue date Jan 7, 2014
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball loading mask, apparatus and associated methodology

    • Patent number 8,448,838
    • Issue date May 28, 2013
    • Ibiden Co., Ltd.
    • Shigeki Sawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 8,198,546
    • Issue date Jun 12, 2012
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball loading mask, apparatus and associated methodology

    • Patent number 8,157,157
    • Issue date Apr 17, 2012
    • Ibiden Co., Ltd.
    • Shigeki Sawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Plating apparatus and plating method

    • Patent number 8,128,790
    • Issue date Mar 6, 2012
    • Ibiden Co., Ltd.
    • Yasuaki Tachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 8,022,314
    • Issue date Sep 20, 2011
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 8,017,875
    • Issue date Sep 13, 2011
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 8,003,897
    • Issue date Aug 23, 2011
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball loading method and solder ball loading unit

    • Patent number 7,866,529
    • Issue date Jan 11, 2011
    • Ibiden Co., Ltd.
    • Atsunori Sumita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 7,714,233
    • Issue date May 11, 2010
    • Ibiden Co., Ltd.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball loading method and solder ball loading unit background...

    • Patent number 7,475,803
    • Issue date Jan 13, 2009
    • Ibiden Co., Ltd.
    • Atsunori Sumita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Etching solution, method of etching and printed wiring board

    • Patent number 7,357,879
    • Issue date Apr 15, 2008
    • Ibiden Co., Ltd.
    • Tsunehisa Takahashi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    Solder Ball Loading Mask, Apparatus And Associated Methodology

    • Publication number 20120080504
    • Publication date Apr 5, 2012
    • IBIDEN, CO., LTD.
    • Shigeki Sawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder Ball Loading Mask, Apparatus and Associated Methodology

    • Publication number 20120080505
    • Publication date Apr 5, 2012
    • IBIDEN, CO., LTD.
    • Shigeki Sawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD

    • Publication number 20120073977
    • Publication date Mar 29, 2012
    • IBIDEN CO., LTD.
    • Yasuaki Tachi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20110214915
    • Publication date Sep 8, 2011
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20110061232
    • Publication date Mar 17, 2011
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20100155129
    • Publication date Jun 24, 2010
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20100065323
    • Publication date Mar 18, 2010
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY

    • Publication number 20090294516
    • Publication date Dec 3, 2009
    • IBIDEN, CO., LTD.
    • Shigeki Sawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING UNIT

    • Publication number 20090084827
    • Publication date Apr 2, 2009
    • IBIDEN CO., LTD.
    • Atsunori Sumita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD

    • Publication number 20090032404
    • Publication date Feb 5, 2009
    • IBIDEN CO., LTD.
    • Yasuaki Tachi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20080149369
    • Publication date Jun 26, 2008
    • IBIDEN CO., LTD.
    • Yoichiro KAWAMURA
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Printed wiring board

    • Publication number 20070096327
    • Publication date May 3, 2007
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed wiring board

    • Publication number 20070086147
    • Publication date Apr 19, 2007
    • IBIDEN CO., LTD.
    • Yoichiro Kawamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Etching solution, method of etching and printed wiring board

    • Publication number 20060199394
    • Publication date Sep 7, 2006
    • Tsunehisa Takahashi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Solder ball loading method and solder ball loading unit background...

    • Publication number 20060157540
    • Publication date Jul 20, 2006
    • IBIDEN CO., LTD.
    • Atsunori Sumita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR