Shigeo Sasaki

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Chigasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating a semiconductor element in a semiconductor el...
- Patent number 6,555,418
- Issue date Apr 29, 2003
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,294,439
- Issue date Sep 25, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Push-up pin of a semiconductor element pushing-up device, and a met...
- Patent number 6,201,306
- Issue date Mar 13, 2001
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,184,109
- Issue date Feb 6, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 5,888,883
- Issue date Mar 30, 1999
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Push-up pin of a semiconductor element pushing-up device, a semicon...
- Publication number 20010017403
- Publication date Aug 30, 2001
- KABUSHIKI KAISHA TOSHIBA
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS