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Flip-chip bonding apparatus
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Patent number 6,311,391
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Issue date Nov 6, 2001
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS
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Wafer ring feeding apparatus
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Patent number 6,062,795
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Issue date May 16, 2000
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS
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Magazine conveying device
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Patent number 5,882,166
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Issue date Mar 16, 1999
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Magazine conveying device
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Patent number 5,868,542
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Issue date Feb 9, 1999
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS
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Lead frame pusher device
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Patent number 5,827,035
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Issue date Oct 27, 1998
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Magazine conveying device
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Patent number 5,733,090
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Issue date Mar 31, 1998
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Magazine conveying device
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Patent number 5,727,917
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Issue date Mar 17, 1998
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS
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Pellet pick-up device
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Patent number 5,725,728
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Issue date Mar 10, 1998
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS
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Dispenser apparatus
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Patent number 4,938,383
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Issue date Jul 3, 1990
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Kabushiki Kaisha Shinkawa
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Nobuto Yamazaki
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B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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Wafer supplying apparatus
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Patent number 4,936,944
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Issue date Jun 26, 1990
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Kabushiki Kaisha Shinkawa
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Shigeru Fuke
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H01 - BASIC ELECTRIC ELEMENTS