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Shigeru HAYATA

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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 12,261,148
    • Issue date Mar 25, 2025
    • Shinkawa Ltd.
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 12,057,427
    • Issue date Aug 6, 2024
    • Shinkawa Ltd.
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 11,367,703
    • Issue date Jun 21, 2022
    • Shinkawa Ltd.
    • Hiroya Yuzawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and method for detecting height of bonding target
    • Patent number 10,816,322
    • Issue date Oct 27, 2020
    • Shinkawa Ltd.
    • Shigeru Hayata
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Bonding apparatus and method of estimating position of landing poin...
    • Patent number 10,586,781
    • Issue date Mar 10, 2020
    • Shinkawa Ltd.
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus and wire bonding method
    • Patent number 10,262,968
    • Issue date Apr 16, 2019
    • Shinkawa Ltd.
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mounting apparatus
    • Patent number 10,118,246
    • Issue date Nov 6, 2018
    • SHINIKAWA LTD.
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding stage height adjustment method for th...
    • Patent number 7,886,956
    • Issue date Feb 15, 2011
    • Shinkawa Ltd.
    • Kohei Seyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Imaging device and method for a bonding apparatus
    • Patent number 7,848,022
    • Issue date Dec 7, 2010
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 6,945,446
    • Issue date Sep 20, 2005
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,814,121
    • Issue date Nov 9, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Offset measurement method, tool position detection method and bondi...
    • Patent number 6,762,848
    • Issue date Jul 13, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,683,731
    • Issue date Jan 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,657,799
    • Issue date Dec 2, 2003
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,467,673
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,464,126
    • Issue date Oct 15, 2002
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,381,359
    • Issue date Apr 30, 2002
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • G02 - OPTICS
  • Information Patent Grant

    Flip-chip bonding apparatus
    • Patent number 6,311,391
    • Issue date Nov 6, 2001
    • Kabushiki Kaisha Shinkawa
    • Shigeru Fuke
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
    • Publication number 20240105672
    • Publication date Mar 28, 2024
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20230178510
    • Publication date Jun 8, 2023
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20230125756
    • Publication date Apr 27, 2023
    • SHINKAWA LTD.
    • Osamu KAKUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20210202432
    • Publication date Jul 1, 2021
    • SHINKAWA LTD.
    • Hiroya YUZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE AND METHOD FOR DETECTING HEIGHT OF SUBJECT
    • Publication number 20200132438
    • Publication date Apr 30, 2020
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    WIRE BONDING APPARATUS AND WIRE BONDING METHOD
    • Publication number 20180090464
    • Publication date Mar 29, 2018
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING APPARATUS
    • Publication number 20170291251
    • Publication date Oct 12, 2017
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS AND METHOD OF ESTIMATING POSITION OF LANDING POIN...
    • Publication number 20170154864
    • Publication date Jun 1, 2017
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS AND BONDING METHOD
    • Publication number 20170148759
    • Publication date May 25, 2017
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS AND BONDING STAGE HEIGHT ADJUSTMENT METHOD FOR TH...
    • Publication number 20100301101
    • Publication date Dec 2, 2010
    • SHINKAWA LTD.
    • Kohei Seyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Imaging device for a bonding apparatus
    • Publication number 20100067123
    • Publication date Mar 18, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • G02 - OPTICS
  • Information Patent Application

    Imaging device and method for a bonding apparatus
    • Publication number 20090124028
    • Publication date May 14, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Imaging device and method for a bonding apparatus
    • Publication number 20090059361
    • Publication date Mar 5, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030123866
    • Publication date Jul 3, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20030099049
    • Publication date May 29, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method and apparatus
    • Publication number 20030098426
    • Publication date May 29, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030030821
    • Publication date Feb 13, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Offset measurement method, tool position detection method and bondi...
    • Publication number 20010042770
    • Publication date Nov 22, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010016062
    • Publication date Aug 23, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010011669
    • Publication date Aug 9, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS