Shigeru Michiwaki

Person

Ayase-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,537,021
- Issue date Jan 14, 2020
- Meiko Electronics Co., Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment agent and novel compound
- Patent number 10,385,076
- Issue date Aug 20, 2019
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,244,624
- Issue date Mar 26, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment method, surface treatment agent, and novel compound
- Patent number 9,790,242
- Issue date Oct 17, 2017
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Process for forming metal film, and product equipped with metal film
- Patent number 9,593,423
- Issue date Mar 14, 2017
- Sulfur Chemical Laboratory Incorporated
- Kunio Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate manufacturing method
- Patent number 9,380,711
- Issue date Jun 28, 2016
- MEIKO ELECTRONICS CO., LTD.
- Shukichi Takii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing printed circuit board, and printed board produc...
- Patent number 9,185,811
- Issue date Nov 10, 2015
- MEIKO ELECTRONICS CO., LTD.
- Yoichi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming metal film, and product equipped with metal film
- Patent number 8,753,748
- Issue date Jun 17, 2014
- Sulfur Chemical Laboratory Incorporated
- Kunio Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board
- Patent number 7,800,917
- Issue date Sep 21, 2010
- Meiko Electronics Co., Ltd.
- Hiroshi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having rigid portion and flexible portion, and...
- Patent number 6,841,738
- Issue date Jan 11, 2005
- Victor Company of Japan, Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 6,704,208
- Issue date Mar 9, 2004
- Victor Company of Japan, Ltd.
- Koichi Kamiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20190124763
- Publication date Apr 25, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20180160528
- Publication date Jun 7, 2018
- Meiko Electronics Co., Ltd.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATMENT AGENT AND NOVEL COMPOUND
- Publication number 20170334933
- Publication date Nov 23, 2017
- Sulfur Chemical Laboratory, Inc.
- Kunio MORI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND
- Publication number 20150152124
- Publication date Jun 4, 2015
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM
- Publication number 20140227539
- Publication date Aug 14, 2014
- Kunio Mori
- Kunio MORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate Manufacturing Method
- Publication number 20140224762
- Publication date Aug 14, 2014
- Meiko Electronics Co., Ltd.
- Shukichi Takii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM
- Publication number 20130183534
- Publication date Jul 18, 2013
- Kunio Mori
- Kunio Mori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARD, AND PRINTED BOARD PRODUC...
- Publication number 20130043063
- Publication date Feb 21, 2013
- Yoichi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and production method therefor
- Publication number 20070025091
- Publication date Feb 1, 2007
- Victor Company of Japan, Ltd. a corporation of Japan
- Hiroshi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board having rigid portion and flexible portion, and...
- Publication number 20040112632
- Publication date Jun 17, 2004
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20030063443
- Publication date Apr 3, 2003
- Koichi Kamiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production method of thin film passive element formed on printed ci...
- Publication number 20020171530
- Publication date Nov 21, 2002
- VICTOR COMPANY OF JAPAN, LIMITED
- Motoshi Shindoh
- H01 - BASIC ELECTRIC ELEMENTS

Shigeru Michiwaki

Person

Patents Grantslast 30 patents

Three-dimensional wiring board production method, three-dimensional...

Surface treatment agent and novel compound

Three-dimensional wiring board production method, three-dimensional...

Surface treatment method, surface treatment agent, and novel compound

Process for forming metal film, and product equipped with metal film

Substrate manufacturing method

Method of producing printed circuit board, and printed board produc...

Process for forming metal film, and product equipped with metal film

Printed wiring board

Printed wiring board having rigid portion and flexible portion, and...

Printed circuit board and manufacturing method thereof

Patents Applicationslast 30 patents

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

SURFACE TREATMENT AGENT AND NOVEL COMPOUND

SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND

PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM

Substrate Manufacturing Method

PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM

METHOD OF PRODUCING PRINTED CIRCUIT BOARD, AND PRINTED BOARD PRODUC...

Printed wiring board and production method therefor

Printed wiring board having rigid portion and flexible portion, and...

Printed circuit board and manufacturing method thereof

Production method of thin film passive element formed on printed ci...