Shigeru MIZUNO

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component-embedded board
- Patent number 10,510,638
- Issue date Dec 17, 2019
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming side wirings
- Patent number 7,807,561
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having side surface wiring
- Patent number 7,777,349
- Issue date Aug 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip-chip connection that uses gallium or...
- Patent number 7,750,484
- Issue date Jul 6, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thin semiconductor chip
- Patent number 6,974,721
- Issue date Dec 13, 2005
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered semiconductor device and method for producing the same
- Patent number 6,849,945
- Issue date Feb 1, 2005
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of production of same
- Patent number 6,774,467
- Issue date Aug 10, 2004
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring board substrate and semiconductor device using t...
- Patent number 6,518,672
- Issue date Feb 11, 2003
- Shinko Electric Industries Co., Ltd.
- Takashi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method thereof and semiconductor device
- Patent number 6,455,786
- Issue date Sep 24, 2002
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 6,407,460
- Issue date Jun 18, 2002
- Shinko Electric Industries Co.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED BOARD
- Publication number 20190103335
- Publication date Apr 4, 2019
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SIDE WIRINGS
- Publication number 20090023247
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020889
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020887
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090001571
- Publication date Jan 1, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin semiconductor chip manufacturing method
- Publication number 20050176169
- Publication date Aug 11, 2005
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layered semiconductor device and method for producing the same
- Publication number 20010054756
- Publication date Dec 27, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer wiring board substrate and semiconductor device using t...
- Publication number 20010054757
- Publication date Dec 27, 2001
- Takashi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process of production of same
- Publication number 20010026010
- Publication date Oct 4, 2001
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Shigeru MIZUNO

Person

Patents Grantslast 30 patents

Electronic component-embedded board

Method for forming side wirings

Semiconductor apparatus having side surface wiring

Semiconductor device with flip-chip connection that uses gallium or...

Method for manufacturing thin semiconductor chip

Multi-layered semiconductor device and method for producing the same

Semiconductor device and process of production of same

Multi-layer wiring board substrate and semiconductor device using t...

Wiring board and manufacturing method thereof and semiconductor device

Multilayer circuit board

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT-EMBEDDED BOARD

METHOD FOR FORMING SIDE WIRINGS

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Thin semiconductor chip manufacturing method

Multi-layered semiconductor device and method for producing the same

Multi-layer wiring board substrate and semiconductor device using t...

Semiconductor device and process of production of same