Shigeru Tanabe

Follow

Person

Ishikawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding equipment for manufacturing semiconductor device...
- Patent number 7,804,160
- Issue date Sep 28, 2010
- Kabushiki Kaisha Toshiba
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20100323476
- Publication date Dec 23, 2010
- KABUSHIKI KAISHA TOSHIBA
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic bonding equipment for manufacturing semiconductor device...
- Publication number 20060118932
- Publication date Jun 8, 2006
- KABUSHIKI KAISHA TOSHIBA
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Strap bonding machine and method of manufacturing a semiconductor d...
- Publication number 20060016855
- Publication date Jan 26, 2006
- Kabushiki Kaisha Toshiba
- Shigeru Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR