SHIGERU YAMATSU

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux resin composition, electronic component, method for manufactur...
- Patent number 12,269,945
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shohei Sanada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux resin composition, electronic component, method for manufactur...
- Patent number 12,240,061
- Issue date Mar 4, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shohei Sanada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation resin composition, laminated sheet, cured product, se...
- Patent number 11,674,032
- Issue date Jun 13, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting composition for use as underfill material, and semico...
- Patent number 11,195,769
- Issue date Dec 7, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic composition for encapsulation, sheet material, laminated sh...
- Patent number 10,870,756
- Issue date Dec 22, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic resin composition for sealing, cured product of same, metho...
- Patent number 10,797,013
- Issue date Oct 6, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jin Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic composition for sealing, sheet material, multilayer sheet,...
- Patent number 10,703,939
- Issue date Jul 7, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...
- Publication number 20230141042
- Publication date May 11, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Shohei SANADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...
- Publication number 20220195177
- Publication date Jun 23, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Shohei SANADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...
- Publication number 20220115285
- Publication date Apr 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Kazunari TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCING RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MAN...
- Publication number 20220049085
- Publication date Feb 17, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...
- Publication number 20200377715
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING COMPOSITION FOR USE AS UNDERFILL MATERIAL, AND SEMICO...
- Publication number 20200381321
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOLDER PASTE AND MOUNT STRUCTURE
- Publication number 20200306893
- Publication date Oct 1, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- YASUHIRO SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...
- Publication number 20200010675
- Publication date Jan 9, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- SHIGERU YAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC COMPOSITION FOR SEALING, SHEET MATERIAL, MULTILAYER SHEET,...
- Publication number 20190284442
- Publication date Sep 19, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUKI WATANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ACRYLIC RESIN COMPOSITION FOR SEALING, CURED PRODUCT OF SAME, METHO...
- Publication number 20180247910
- Publication date Aug 30, 2018
- JIN JIN
- H01 - BASIC ELECTRIC ELEMENTS

SHIGERU YAMATSU

Person

Patents Grantslast 30 patents

Reinforcing resin composition, electronic component, method for man...

Flux resin composition, electronic component, method for manufactur...

Flux resin composition, electronic component, method for manufactur...

Encapsulation resin composition, laminated sheet, cured product, se...

Thermosetting composition for use as underfill material, and semico...

Acrylic composition for encapsulation, sheet material, laminated sh...

Acrylic resin composition for sealing, cured product of same, metho...

Acrylic composition for sealing, sheet material, multilayer sheet,...

Patents Applicationslast 30 patents

FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...

FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...

ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...

REINFORCING RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MAN...

ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...

THERMOSETTING COMPOSITION FOR USE AS UNDERFILL MATERIAL, AND SEMICO...

SOLDER PASTE AND MOUNT STRUCTURE

ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...

ACRYLIC COMPOSITION FOR SEALING, SHEET MATERIAL, MULTILAYER SHEET,...

ACRYLIC RESIN COMPOSITION FOR SEALING, CURED PRODUCT OF SAME, METHO...