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Shigeto IYODA

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  • Ogaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate
    • Patent number 11,903,128
    • Issue date Feb 13, 2024
    • Ibiden Co., Ltd.
    • Shigeto Iyoda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing multilayer wiring substrate
    • Patent number 11,706,873
    • Issue date Jul 18, 2023
    • Ibiden Co., Ltd.
    • Shigeto Iyoda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230115650
    • Publication date Apr 13, 2023
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20220377884
    • Publication date Nov 24, 2022
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20220377883
    • Publication date Nov 24, 2022
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE
    • Publication number 20220110215
    • Publication date Apr 7, 2022
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR