Shigeyoshi Netsu

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Fukushima, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer manufacturing method, polishing apparatus, and wafer
- Patent number 7,582,221
- Issue date Sep 1, 2009
- Shin-Etsu Handotai Co., Ltd.
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and device for semiconductor device manufacturi...
- Patent number 6,787,797
- Issue date Sep 7, 2004
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER
- Publication number 20090057840
- Publication date Mar 5, 2009
- Shin-Etsu Handotai Co., Ltd.
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Application
Wafer manufacturing method, polishing apparatus , and wafer
- Publication number 20030022495
- Publication date Jan 30, 2003
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer and device for semiconductor device manufacturi...
- Publication number 20020167006
- Publication date Nov 14, 2002
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS