Shigeyuki MARUYAMA

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Contactor including a covalent bond layer
- Patent number 8,766,659
- Issue date Jul 1, 2014
- Fujitsu Semiconductor Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of testing a semiconductor device and suctioning a semicondu...
- Patent number 8,759,119
- Issue date Jun 24, 2014
- Fujitsu Semiconductor Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Tray in combination with electronic component attaching tool attach...
- Patent number 8,671,557
- Issue date Mar 18, 2014
- Fujitsu Semiconductor Limited
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of testing a semiconductor device and suctioning a semicondu...
- Patent number 8,404,496
- Issue date Mar 26, 2013
- Fujitsu Semiconductor Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of semiconductor device protection
- Patent number 8,268,670
- Issue date Sep 18, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device packaging structure
- Patent number 8,164,181
- Issue date Apr 24, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
IC socket with attached electronic component
- Patent number 8,051,554
- Issue date Nov 8, 2011
- Fujitsu Semiconductor Limited
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Temperature control method and temperature control device
- Patent number 7,921,906
- Issue date Apr 12, 2011
- Fujitsu Semiconductor Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of semiconductor device protection, package of semiconductor...
- Patent number 7,807,481
- Issue date Oct 5, 2010
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contact piece member, contactor and contact method
- Patent number 7,795,552
- Issue date Sep 14, 2010
- Fujitsu Semiconductor Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level package having test terminal
- Patent number 7,642,551
- Issue date Jan 5, 2010
- Fujitsu Microelectronics Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for electronic components and test method using the same
- Patent number 7,518,388
- Issue date Apr 14, 2009
- Fujitsu Microelectronics Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for electronic parts and a contact method
- Patent number 7,471,096
- Issue date Dec 30, 2008
- Fujitsu Limited
- Naohito Kohashi
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component attaching tool
- Patent number 7,430,798
- Issue date Oct 7, 2008
- Fujitsu Limited
- Daisuke Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactor having contact electrodes of metal springs embedded in a...
- Patent number 7,403,024
- Issue date Jul 22, 2008
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level package having test terminal
- Patent number 7,399,990
- Issue date Jul 15, 2008
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device protection cover, and semiconductor device uni...
- Patent number 7,382,046
- Issue date Jun 3, 2008
- Fujitsu Limited
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus testing arrangement and semiconductor appar...
- Patent number 7,355,421
- Issue date Apr 8, 2008
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for electronic components and test method using the same
- Patent number 7,309,996
- Issue date Dec 18, 2007
- Fujitsu Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connecting method
- Patent number 7,276,924
- Issue date Oct 2, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Anisotropic conductive sheet, production process, contact structure...
- Patent number 7,267,559
- Issue date Sep 11, 2007
- Fujitsu Limited
- Takafumi Hashitani
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device testing contactor ha...
- Patent number 7,240,432
- Issue date Jul 10, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having conductive particles in a hole as a contact electrode
- Patent number 7,202,679
- Issue date Apr 10, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Device testing contactor, method of producing the same, and device...
- Patent number 7,196,530
- Issue date Mar 27, 2007
- Fujitsu Limited
- Makoto Haseyama
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 7,174,629
- Issue date Feb 13, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testing device
- Patent number 7,161,370
- Issue date Jan 9, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
LSI package, LSI element testing method, and semiconductor device m...
- Patent number 7,145,250
- Issue date Dec 5, 2006
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Testing device and testing method of a semiconductor device
- Patent number 7,129,726
- Issue date Oct 31, 2006
- Fujitsu Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having an alignment mark formed by the same ma...
- Patent number 7,112,889
- Issue date Sep 26, 2006
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Wafer-level package having test terminal
- Patent number 7,071,487
- Issue date Jul 4, 2006
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF TESTING A SEMICONDUCTOR DEVICE AND SUCTIONING A SEMICONDU...
- Publication number 20130171748
- Publication date Jul 4, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...
- Publication number 20120005883
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION
- Publication number 20120005875
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTOR, TEST DEVICE FOR SEMICONDUCTOR APPARATUS, AND METHOD FOR...
- Publication number 20110212551
- Publication date Sep 1, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Shigeyuki MARUYAMA
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...
- Publication number 20110049699
- Publication date Mar 3, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...
- Publication number 20080299790
- Publication date Dec 4, 2008
- FUJITSU LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Wafer-level package having test terminal
- Publication number 20080251788
- Publication date Oct 16, 2008
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor substrate, manufacturing method of a semiconductor de...
- Publication number 20080227226
- Publication date Sep 18, 2008
- Fujitsu Limited
- Shigeru Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of semiconductor device protection, package of semiconductor...
- Publication number 20080203558
- Publication date Aug 28, 2008
- FUJITSU LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contactor for electronic components and test method using the same
- Publication number 20080136433
- Publication date Jun 12, 2008
- Fujitsu Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Application
Contact piece member, contactor and contact method
- Publication number 20070222070
- Publication date Sep 27, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor apparatus testing arrangement and semiconductor appar...
- Publication number 20070096761
- Publication date May 3, 2007
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device having an alignment mark formed by the same ma...
- Publication number 20060279003
- Publication date Dec 14, 2006
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Temperature control method and temperature control device
- Publication number 20060245161
- Publication date Nov 2, 2006
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Testing device and testing method of a semiconductor device
- Publication number 20060220667
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Application
Wafer-level package having test terminal
- Publication number 20060202201
- Publication date Sep 14, 2006
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for electronic parts and a contact method
- Publication number 20060186905
- Publication date Aug 24, 2006
- Fujitsu Limited
- Naohito Kohashi
- G01 - MEASURING TESTING
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20060119374
- Publication date Jun 8, 2006
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor substrate, manufacturing method of a semiconductor de...
- Publication number 20060097356
- Publication date May 11, 2006
- FUJITSU LIMITED
- Shigeru Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connecting method
- Publication number 20050253614
- Publication date Nov 17, 2005
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing a semiconductor device testing contactor ha...
- Publication number 20050225342
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Method of attaching electronic component and electronic component a...
- Publication number 20050204551
- Publication date Sep 22, 2005
- FUJITSU LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
LSI package, LSI element testing method, and semiconductor device m...
- Publication number 20050189649
- Publication date Sep 1, 2005
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor testing device
- Publication number 20050162180
- Publication date Jul 28, 2005
- FIJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20050110509
- Publication date May 26, 2005
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Method of semiconductor device protection, package of semiconductor...
- Publication number 20050072972
- Publication date Apr 7, 2005
- FUJITSU LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contactor for testing semiconductor device and manufacturing method...
- Publication number 20040266272
- Publication date Dec 30, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for electronic components and test method using the same
- Publication number 20040239357
- Publication date Dec 2, 2004
- FUJITSU LIMITED
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Application
Wafer-level package, a method of manufacturing thereof and a method...
- Publication number 20040206954
- Publication date Oct 21, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor testing device
- Publication number 20040124866
- Publication date Jul 1, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Shigeyuki MARUYAMA

Person

Patents Grantslast 30 patents

Contactor including a covalent bond layer

Method of testing a semiconductor device and suctioning a semicondu...

Tray in combination with electronic component attaching tool attach...

Method of testing a semiconductor device and suctioning a semicondu...

Method of semiconductor device protection

Semiconductor device packaging structure

IC socket with attached electronic component

Temperature control method and temperature control device

Method of semiconductor device protection, package of semiconductor...

Contact piece member, contactor and contact method

Wafer-level package having test terminal

Contactor for electronic components and test method using the same

Contactor for electronic parts and a contact method

Electronic component attaching tool

Contactor having contact electrodes of metal springs embedded in a...

Wafer-level package having test terminal

Semiconductor device protection cover, and semiconductor device uni...

Semiconductor apparatus testing arrangement and semiconductor appar...

Contactor for electronic components and test method using the same

Electrical connecting method

Anisotropic conductive sheet, production process, contact structure...

Method of manufacturing a semiconductor device testing contactor ha...

Contactor having conductive particles in a hole as a contact electrode

Device testing contactor, method of producing the same, and device...

Integrated circuit contactor, and method and apparatus for producti...

Semiconductor testing device

LSI package, LSI element testing method, and semiconductor device m...

Testing device and testing method of a semiconductor device

Semiconductor device having an alignment mark formed by the same ma...

Wafer-level package having test terminal

Patents Applicationslast 30 patents

METHOD OF TESTING A SEMICONDUCTOR DEVICE AND SUCTIONING A SEMICONDU...

METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...

METHOD OF SEMICONDUCTOR DEVICE PROTECTION

CONTACTOR, TEST DEVICE FOR SEMICONDUCTOR APPARATUS, AND METHOD FOR...

METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...

METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...

Wafer-level package having test terminal

Semiconductor substrate, manufacturing method of a semiconductor de...

Method of semiconductor device protection, package of semiconductor...

Contactor for electronic components and test method using the same

Contact piece member, contactor and contact method

Semiconductor apparatus testing arrangement and semiconductor appar...

Semiconductor device having an alignment mark formed by the same ma...

Temperature control method and temperature control device

Testing device and testing method of a semiconductor device

Wafer-level package having test terminal

Contactor for electronic parts and a contact method

Contactor having conductive particles in a hole as a contact electrode

Semiconductor substrate, manufacturing method of a semiconductor de...

Electrical connecting method

Method of manufacturing a semiconductor device testing contactor ha...

Method of attaching electronic component and electronic component a...

LSI package, LSI element testing method, and semiconductor device m...

Semiconductor testing device

Contactor having conductive particles in a hole as a contact electrode

Method of semiconductor device protection, package of semiconductor...

Contactor for testing semiconductor device and manufacturing method...

Contactor for electronic components and test method using the same

Wafer-level package, a method of manufacturing thereof and a method...

Semiconductor testing device