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Shigeyuki NAKAHAMA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus
    • Patent number 12,221,712
    • Issue date Feb 11, 2025
    • Ebara Corporation
    • Shigeyuki Nakahama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240368800
    • Publication date Nov 7, 2024
    • EBARA CORPORATION
    • Shigeyuki NAKAHAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240183057
    • Publication date Jun 6, 2024
    • EBARA CORPORATION
    • Shigeyuki NAKAHAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR