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Shigeyuki Yonezawa
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Lead wire pull-out apparatus
Patent number
9,090,430
Issue date
Jul 28, 2015
Toshiba Mitsubishi-Electric Industrial Systems Corporation
Hideki Miura
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
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Patent Application
LEAD WIRE EXTRACTION DEVICE
Publication number
20130153704
Publication date
Jun 20, 2013
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Hideki Miura
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL