Shih-Chang Lee

Person

Ta-She Hsiang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carbon fiber composite casing with an electromagnetic-wave penetrab...
- Patent number D813812
- Issue date Mar 27, 2018
- Catcher Technology Co., Ltd.
- Chihhsing Lin
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Process of fabricating a circuit board
- Patent number 8,720,053
- Issue date May 13, 2014
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rapid thermal processing system and sulfidation method thereof
- Patent number 8,507,366
- Issue date Aug 13, 2013
- Axuntek Solar Energy
- Shih-Wei Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing see-through solar battery module
- Patent number 8,492,191
- Issue date Jul 23, 2013
- Axuntek Solar Energy
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Solar tile structure
- Patent number D653611
- Issue date Feb 7, 2012
- Axuntek Solar Energy
- Shih-Wei Lee
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor chip package
- Patent number 7,605,020
- Issue date Oct 20, 2009
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure and the packaging process thereof
- Patent number 7,439,619
- Issue date Oct 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps
- Patent number 7,375,020
- Issue date May 20, 2008
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for balancing molding flow during the assembly of semiconduc...
- Patent number 7,195,956
- Issue date Mar 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact sensor package
- Patent number 7,193,282
- Issue date Mar 20, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked package module
- Patent number 7,187,070
- Issue date Mar 6, 2007
- Advanced Semiconductor Engineering, Inc.
- Chi Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for liquid crystal display
- Patent number 7,169,653
- Issue date Jan 30, 2007
- Hannstar Display Corp.
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 7,151,308
- Issue date Dec 19, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,126,221
- Issue date Oct 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact sensor package structure
- Patent number 7,122,757
- Issue date Oct 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 7,061,079
- Issue date Jun 13, 2006
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure
- Patent number 7,019,407
- Issue date Mar 28, 2006
- Advanced Semiconductor Engineering, Inc.
- Yu-Wen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chips module assembly package
- Patent number 7,015,571
- Issue date Mar 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Chih-Huang Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal enhance MCM package and manufacturing method thereof
- Patent number 7,002,805
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps
- Patent number 6,916,732
- Issue date Jul 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Tsung-Hua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package
- Patent number 6,815,833
- Issue date Nov 9, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and manufacturing method thereof
- Patent number 6,724,075
- Issue date Apr 20, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnected structure and a fabrication method thereof
- Patent number 6,624,004
- Issue date Sep 23, 2003
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 6,610,924
- Issue date Aug 26, 2003
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display (LCD) cell transport apparatus
- Patent number 6,525,800
- Issue date Feb 25, 2003
- Hannstar Display Corp.
- Shih Yang Lee
- B08 - CLEANING
Information Patent Grant
Method of making leadless semiconductor package
- Patent number 6,524,886
- Issue date Feb 25, 2003
- Advanced Semiconductor Engineering Inc.
- Shih Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strip for use in packaging semiconductor chips and method...
- Patent number 6,482,675
- Issue date Nov 19, 2002
- Advanced Semiconductor Engineering Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and molding method for flexible substrate based p...
- Patent number 6,465,277
- Issue date Oct 15, 2002
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for fabricating a flexible substrate based ball grid array (...
- Patent number 6,380,002
- Issue date Apr 30, 2002
- Advanced Semiconductor Engineering, Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strip for use in packaging semiconductor chips
- Patent number 6,262,490
- Issue date Jul 17, 2001
- Advanced Semiconductor Engineering, Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYAMIC ACID, POLYIMIDE, AND ELEMENT FORMED THEREFROM
- Publication number 20220348717
- Publication date Nov 3, 2022
- LCY Chemical Corp.
- Chuan-Jen FU
- G02 - OPTICS
Information Patent Application
SUBSTRATE CARRIER AND SELENIZATION PROCESS SYSTEM THEREOF
- Publication number 20130236844
- Publication date Sep 12, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20130133720
- Publication date May 30, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID THERMAL PROCESSING SYSTEM AND SULFIDATION METHOD THEREOF
- Publication number 20130130432
- Publication date May 23, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL BATH DEPOSITION SYSTEM AND RELATED CHEMICAL BATH DEPOSITIO...
- Publication number 20130122190
- Publication date May 16, 2013
- Shih-Wei Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL BATH DEPOSITION SYSTEM
- Publication number 20130118403
- Publication date May 16, 2013
- Shih-Wei Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE SOLAR BATTERY MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20130098421
- Publication date Apr 25, 2013
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEE-THROUGH SOLAR BATTERY MODULE
- Publication number 20130084673
- Publication date Apr 4, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM SOLAR CELL MANUFACTURING SYSTEM
- Publication number 20130074772
- Publication date Mar 28, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20130068276
- Publication date Mar 21, 2013
- AXUNTEK SOLAR ENERGY
- Shih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20120291853
- Publication date Nov 22, 2012
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20120291834
- Publication date Nov 22, 2012
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR TILE STRUCTURE
- Publication number 20120291855
- Publication date Nov 22, 2012
- Shih-Wei Lee
- F24 - HEATING RANGES VENTILATING
Information Patent Application
SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20110265858
- Publication date Nov 3, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20110265841
- Publication date Nov 3, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20110265843
- Publication date Nov 3, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR PANEL HEAT-DISSIPATING DEVICE AND RELATED SOLAR PANEL MODULE
- Publication number 20110168233
- Publication date Jul 14, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR PANEL TILE STRUCTURE AND COMBINATION THEREOF
- Publication number 20110155220
- Publication date Jun 30, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR TILE STRUCTURE AND COMBINATION THEREOF
- Publication number 20110155206
- Publication date Jun 30, 2011
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR CELL AND MANUFACTURING METHOD THEREOF
- Publication number 20100288350
- Publication date Nov 18, 2010
- Shih-Wei Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LASER SCRIBER WITH SELF-CORRECTING MECHANISM AND SELF-CORRECTION ME...
- Publication number 20100264122
- Publication date Oct 21, 2010
- AXUNTEK SOLAR ENERGY CO., LTD.
- Shih-Wei Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME
- Publication number 20100071937
- Publication date Mar 25, 2010
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor chip package and method for manufacturing the same
- Publication number 20070087478
- Publication date Apr 19, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050275074
- Publication date Dec 15, 2005
- Gwo-Liang Weng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Contact sensor package structure
- Publication number 20050274597
- Publication date Dec 15, 2005
- Shih-Chang Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for balancing molding flow during the assembly of semiconduc...
- Publication number 20050266616
- Publication date Dec 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20050181543
- Publication date Aug 18, 2005
- SHIH-CHANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact sensor package
- Publication number 20050168906
- Publication date Aug 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fabrication method for liquid crystal display
- Publication number 20050158900
- Publication date Jul 21, 2005
- Shih-Wei Lee
- G02 - OPTICS
Information Patent Application
Electronic package structure and the packaging process thereof
- Publication number 20050146054
- Publication date Jul 7, 2005
- Chi-Chih Chu
- H01 - BASIC ELECTRIC ELEMENTS

Shih-Chang Lee

Person

Patents Grantslast 30 patents

Carbon fiber composite casing with an electromagnetic-wave penetrab...

Process of fabricating a circuit board

Rapid thermal processing system and sulfidation method thereof

Method for manufacturing see-through solar battery module

Solar tile structure

Semiconductor chip package

Electronic package structure and the packaging process thereof

Method of forming bumps

Method for balancing molding flow during the assembly of semiconduc...

Contact sensor package

Stacked package module

Fabrication method for liquid crystal display

Semiconductor chip package

Semiconductor package

Contact sensor package structure

Chip package structure and manufacturing method thereof

Flip chip package structure

Multi-chips module assembly package

Thermal enhance MCM package and manufacturing method thereof

Method of forming bumps

Flip chip package

Semiconductor chip package and manufacturing method thereof

Flip chip interconnected structure and a fabrication method thereof

Semiconductor package

Liquid crystal display (LCD) cell transport apparatus

Method of making leadless semiconductor package

Substrate strip for use in packaging semiconductor chips and method...

Molding apparatus and molding method for flexible substrate based p...

Method for fabricating a flexible substrate based ball grid array (...

Substrate strip for use in packaging semiconductor chips

Patents Applicationslast 30 patents

POLYAMIC ACID, POLYIMIDE, AND ELEMENT FORMED THEREFROM

SUBSTRATE CARRIER AND SELENIZATION PROCESS SYSTEM THEREOF

SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

RAPID THERMAL PROCESSING SYSTEM AND SULFIDATION METHOD THEREOF

CHEMICAL BATH DEPOSITION SYSTEM AND RELATED CHEMICAL BATH DEPOSITIO...

CHEMICAL BATH DEPOSITION SYSTEM

FLEXIBLE SOLAR BATTERY MODULE AND RELATED MANUFACTURING METHOD

METHOD FOR MANUFACTURING SEE-THROUGH SOLAR BATTERY MODULE

THIN-FILM SOLAR CELL MANUFACTURING SYSTEM

SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SOLAR TILE STRUCTURE

SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SEE-THROUGH SOLAR BATTERY MODULE AND MANUFACTURING METHOD THEREOF

SOLAR PANEL HEAT-DISSIPATING DEVICE AND RELATED SOLAR PANEL MODULE

SOLAR PANEL TILE STRUCTURE AND COMBINATION THEREOF

SOLAR TILE STRUCTURE AND COMBINATION THEREOF

SOLAR CELL AND MANUFACTURING METHOD THEREOF

LASER SCRIBER WITH SELF-CORRECTING MECHANISM AND SELF-CORRECTION ME...

CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME

Semiconductor chip package and method for manufacturing the same

Semiconductor package and method of manufacturing the same

Contact sensor package structure

Method for balancing molding flow during the assembly of semiconduc...

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Contact sensor package

Fabrication method for liquid crystal display

Electronic package structure and the packaging process thereof