Shih-Chieh Chang

Person

Chiayi County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Storage device for flexible circuit packages and carrier thereof
- Patent number 11,792,923
- Issue date Oct 17, 2023
- Chipbond Technology Corporation
- Shih-Chieh Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
- Patent number 9,059,260
- Issue date Jun 16, 2015
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
- Patent number 8,823,169
- Issue date Sep 2, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame thereof
- Patent number 8,704,345
- Issue date Apr 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,581,384
- Issue date Nov 12, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER AND CHIP THEREOF
- Publication number 20250038130
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Sheng-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
- Publication number 20240008171
- Publication date Jan 4, 2024
- Chipbond Technology Corporation
- Wei-Teng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE FOR FLEXIBLE CIRCUIT PACKAGES AND CARRIER THEREOF
- Publication number 20220110209
- Publication date Apr 7, 2022
- Chipbond Technology Corporation
- Shih-Chieh Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
- Publication number 20140217578
- Publication date Aug 7, 2014
- Chipbond Technology Corporation
- Lung-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140141606
- Publication date May 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140021601
- Publication date Jan 23, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF
- Publication number 20130334671
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130249070
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Shih-Chieh Chang

Person

Patents Grantslast 30 patents

Storage device for flexible circuit packages and carrier thereof

Semiconductor package structure and method for making the same

Semiconductor manufacturing method and semiconductor structure thereof

Semiconductor manufacturing method and semiconductor structure thereof

Semiconductor package and lead frame thereof

Semiconductor package structure and method for making the same

Semiconductor package structure

Patents Applicationslast 30 patents

WAFER AND CHIP THEREOF

SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF

TAPE AND MANUFACTURING METHOD THEREOF

CHIP-ON-FILM PACKAGE

STORAGE DEVICE FOR FLEXIBLE CIRCUIT PACKAGES AND CARRIER THEREOF

SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE