Shih Chieh Tai

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device employing two-dimensional electron gas with reduc...
- Patent number 12,176,431
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,401
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for manufacturing substrate structure having thick e...
- Patent number 11,895,778
- Issue date Feb 6, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,682,647
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,626,341
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,587,887
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin poly field plate design
- Patent number 11,515,398
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT module with heat dissipation structure having specific layer t...
- Patent number 11,469,154
- Issue date Oct 11, 2022
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating substrate structure with built-in conductive circuits
- Patent number 11,388,811
- Issue date Jul 12, 2022
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,289,398
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process for semiconductor packaging and structures resu...
- Patent number 11,158,600
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin poly field plate design
- Patent number 10,825,905
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-substrate packaging on carrier
- Patent number 10,679,951
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-substrate packaging on carrier
- Patent number 10,163,822
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment pattern for package singulation
- Patent number 10,163,807
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ju Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufacur...
- Patent number 9,984,969
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-substrate packaging on carrier
- Patent number 9,922,943
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 9,812,381
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufactu...
- Patent number 9,659,863
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with probe pad structure
- Patent number 9,653,427
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-substrate packaging on carrier
- Patent number 9,524,942
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit package
- Patent number 9,281,254
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory storage device and operation method thereof
- Patent number 8,332,607
- Issue date Dec 11, 2012
- Skymedi Corporation
- Chih Wei Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for enhancing life cycle of memory
- Patent number 8,140,737
- Issue date Mar 20, 2012
- Skymedi Corporation
- Fuja Shone
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nonvolatile memory system and method of decentralizing the peak cur...
- Patent number 8,090,898
- Issue date Jan 3, 2012
- Skymedi Corporation
- Chung-Chiang Chew
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory device, and method of accessing a non-volatile...
- Patent number 8,032,690
- Issue date Oct 4, 2011
- Skymedi Corporation
- Yung-Li Ji
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Protecting method applied to the semiconductor manufacturing process
- Patent number 6,380,090
- Issue date Apr 30, 2002
- Winbond Electrinics Corp
- Mei-Hui Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor treatment process for reducing oxide depletion
- Patent number 6,024,802
- Issue date Feb 15, 2000
- Winbond Electronics Corp.
- Mei-Hui Sung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE EMPLOYING TWO-DIMENSIO...
- Publication number 20250081502
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wen Shih
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250052966
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Yi HUANG
- G02 - OPTICS
Information Patent Application
SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...
- Publication number 20250054871
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250004202
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming WANG
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404909
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379606
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240319590
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...
- Publication number 20240153901
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240128178
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING...
- Publication number 20240118491
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao YU
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240114702
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION
- Publication number 20240114703
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20240113034
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240103218
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
Fan-Out Stacked Package and Methods of Making the Same
- Publication number 20240096722
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trimming Through Etching in Wafer to Wafer Bonding
- Publication number 20240047216
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20240014091
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402340
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386961
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE EMPLOYING TWO-DIMENSIONAL ELECTRON GAS WITH REDUC...
- Publication number 20230369480
- Publication date Nov 16, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tzu-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230361048
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20230352418
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTUR...
- Publication number 20230343677
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230268305
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHIUM BATTERY CHARGE-LIMITING APPARATUS
- Publication number 20230261500
- Publication date Aug 17, 2023
- Powergene Technology Co., Ltd., Taiwan Branch
- Hui-Te HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230215774
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...
- Publication number 20230199968
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shih Chieh Tai

Person

Patents Grantslast 30 patents

Thermal structure for semiconductor device and method of forming th...

Electronic device employing two-dimensional electron gas with reduc...

Semiconductor device and manufacturing method thereof

Package structure

Etching method for manufacturing substrate structure having thick e...

Semiconductor package and method for manufacturing the same

Package structure

Semiconductor device and manufacturing method thereof

Thin poly field plate design

IGBT module with heat dissipation structure having specific layer t...

Heat-dissipating substrate structure with built-in conductive circuits

Package structure and manufacturing method thereof

Lithography process for semiconductor packaging and structures resu...

Thin poly field plate design

Chip-on-substrate packaging on carrier

Chip-on-substrate packaging on carrier

Alignment pattern for package singulation

Semiconductor devices, multi-die packages, and methods of manufacur...

Chip-on-substrate packaging on carrier

Integrated fan-out package and method of fabricating the same

Semiconductor devices, multi-die packages, and methods of manufactu...

Integrated circuit package with probe pad structure

Chip-on-substrate packaging on carrier

Methods of forming integrated circuit package

Non-volatile memory storage device and operation method thereof

Method for enhancing life cycle of memory

Nonvolatile memory system and method of decentralizing the peak cur...

Non-volatile memory device, and method of accessing a non-volatile...

Protecting method applied to the semiconductor manufacturing process

Vapor treatment process for reducing oxide depletion

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE EMPLOYING TWO-DIMENSIO...

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Optical Device and Method of Manufacture

Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION

METHODS FOR FORMING SEMICONDUCTOR PACKAGE

Optical Device and Method of Manufacture

Fan-Out Stacked Package and Methods of Making the Same

Adding Sealing Material to Wafer edge for Wafer Bonding

Trimming Through Etching in Wafer to Wafer Bonding

Thermal Structure for Semiconductor Device and Method of Forming th...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE EMPLOYING TWO-DIMENSIONAL ELECTRON GAS WITH REDUC...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTUR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LITHIUM BATTERY CHARGE-LIMITING APPARATUS

PACKAGE STRUCTURE

METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...