Shih-Hsing CHAN

Follow

Person

Zhuolan Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating wafer-level chip package
- Patent number 9,230,927
- Issue date Jan 5, 2016
- Xintec Inc.
- Chuan-Jin Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
- Publication number 20150099357
- Publication date Apr 9, 2015
- XINTEC INC.
- Chuan-Jin SHIU
- H01 - BASIC ELECTRIC ELEMENTS