Shih-Ting Hung

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,328,862
- Issue date Jun 10, 2025
- Winbond Electronics Corp.
- Shih-Han Hung
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,308,313
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for estimating direct current internal resistance of battery
- Patent number 12,287,374
- Issue date Apr 29, 2025
- Shih Fa Hung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,237,262
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock and data recovery circuit using neural network circuit to obt...
- Patent number 12,224,756
- Issue date Feb 11, 2025
- Mediatek Inc.
- Chien-Kai Kao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical member driving mechanism
- Patent number 12,216,326
- Issue date Feb 4, 2025
- TDK TAIWAN CORP.
- Hsiang-Chin Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Driving mechanism
- Patent number 12,210,208
- Issue date Jan 28, 2025
- TDK TAIWAN CORP.
- Shao-Chung Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Optical system
- Patent number 12,204,163
- Issue date Jan 21, 2025
- TDK TAIWAN CORP.
- Chao-Chang Hu
- G02 - OPTICS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-crystal medium
- Patent number 12,104,109
- Issue date Oct 1, 2024
- Merck Patent GmbH
- Chi-Shun Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,051,654
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rehabilitation assisting apparatus
- Patent number 12,023,290
- Issue date Jul 2, 2024
- Shih-Chieh Hung
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Static voltage drop (SIR) violation prediction systems and methods
- Patent number 12,019,971
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lin Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical element driving mechanism having movable portion for holdin...
- Patent number 11,982,866
- Issue date May 14, 2024
- TDK TAIWAN CORP.
- Chao-Chang Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Replaceable frame assembly for accommodating expansion card module...
- Patent number 11,953,956
- Issue date Apr 9, 2024
- LANNER ELECTRONICS INC.
- Shih-Tai Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical system
- Patent number 11,934,027
- Issue date Mar 19, 2024
- TDK TAIWAN CORP.
- Chao-Chang Hu
- G02 - OPTICS
Information Patent Grant
Semiconductor memory device
- Patent number 11,910,595
- Issue date Feb 20, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,277
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,279
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing device
- Patent number 11,869,270
- Issue date Jan 9, 2024
- AUO Corporation
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 11,848,265
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power tool with electrically controlled commutating assembly
- Patent number 11,833,642
- Issue date Dec 5, 2023
- Techway Industrial Co., Ltd.
- Fu-Hsiang Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atom probe tomography specimen preparation
- Patent number 11,837,435
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,804,451
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric commutating ratchet tool
- Patent number 11,801,587
- Issue date Oct 31, 2023
- Techway Industrial Co., Ltd.
- Fu-Hsiang Chung
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Payment method and system
- Patent number 11,783,329
- Issue date Oct 10, 2023
- MICRO-STAR INT'L CO., LTD.
- Shih-Che Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,770,924
- Issue date Sep 26, 2023
- United Microelectronics Corp.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stator of a brushless motor
- Patent number 11,722,020
- Issue date Aug 8, 2023
- Techway Industrial Co., Ltd.
- Fu Hsiang Chung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Automated balanced global clock tree synthesis in multi level physi...
- Patent number 11,704,467
- Issue date Jul 18, 2023
- Synopsys, Inc.
- Ashima Sahil Dabare
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250210415
- Publication date Jun 26, 2025
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT DRIVING MECHANISM
- Publication number 20250110307
- Publication date Apr 3, 2025
- TDK TAIWAN CORP.
- Chao-Chang HU
- G02 - OPTICS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPERATING SYSTEM AND METHOD OF A FULLY HOMOMORPHIC ENCRYPTION NEURA...
- Publication number 20250086437
- Publication date Mar 13, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Tzu-Li LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFERENCE AND CONVERSION METHOD FOR ENCRYPTED DEEP NEURAL NETWORK M...
- Publication number 20250080320
- Publication date Mar 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Yu-Te KU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20250079428
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20240395636
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240332211
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GREEN COFFEE BEAN IDENTIFICATION METHOD AND GREEN COFFEE BEAN IDENT...
- Publication number 20240265517
- Publication date Aug 8, 2024
- National Tsing-Hua University
- Shu-Min Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL ELEMENT DRIVING MECHANISM
- Publication number 20240264405
- Publication date Aug 8, 2024
- TDK TAIWAN CORP.
- Chao-Chang HU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ESTIMATION METHOD FOR STATE OF HEALTH OF BATTERY
- Publication number 20240241185
- Publication date Jul 18, 2024
- STL TECHNOLOGY CO., LTD.
- Wen-Fan Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188277
- Publication date Jun 6, 2024
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SYSTEM
- Publication number 20240176093
- Publication date May 30, 2024
- TDK TAIWAN CORP.
- Chao-Chang HU
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240178116
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
- Publication number 20240071909
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTIMATING DIRECT CURRENT INTERNAL RESISTANCE OF BATTERY
- Publication number 20240053406
- Publication date Feb 15, 2024
- STL TECHNOLOGY CO., LTD.
- Shih Fa Hung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LIQUID-CRYSTAL MEDIUM
- Publication number 20240002728
- Publication date Jan 4, 2024
- Merck Patent GmbH
- Chi-Shun HUANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CLOCK AND DATA RECOVERY CIRCUIT USING NEURAL NETWORK CIRCUIT TO OBT...
- Publication number 20240007110
- Publication date Jan 4, 2024
- MEDIATEK INC.
- Chien-Kai Kao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20230386783
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
- Publication number 20230378055
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378089
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE
- Publication number 20230351799
- Publication date Nov 2, 2023
- AUO Corporation
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER AND METHOD OF PROCESSING WAFER
- Publication number 20230282472
- Publication date Sep 7, 2023
- GLOBALWAFERS CO., LTD.
- Wen-Huai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215792
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230189498
- Publication date Jun 15, 2023
- UNITED MICROELECTRONICS CORP.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT DRIVING MECHANISM
- Publication number 20230120771
- Publication date Apr 20, 2023
- TDK TAIWAN CORP.
- Chao-Chang HU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REPLACEABLE FRAME ASSEMBLY FOR ACCOMMODATING EXPANSION CARD MODULE...
- Publication number 20230099973
- Publication date Mar 30, 2023
- LANNER ELECTRONICS INC.
- Shih-Tai Hung
- G06 - COMPUTING CALCULATING COUNTING

Shih-Ting Hung

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Semiconductor package with improved interposer structure

Method for estimating direct current internal resistance of battery

Semiconductor package with improved interposer structure

Clock and data recovery circuit using neural network circuit to obt...

Optical member driving mechanism

Driving mechanism

Optical system

Integrated fan-out package, package-on-package structure, and manuf...

Semiconductor devices and methods of manufacturing

Liquid-crystal medium

Package structure and method of fabricating the same

Rehabilitation assisting apparatus

Static voltage drop (SIR) violation prediction systems and methods

Optical element driving mechanism having movable portion for holdin...

Replaceable frame assembly for accommodating expansion card module...

Optical system

Semiconductor memory device

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Sensing device

Semiconductor package with improved interposer structure

Power tool with electrically controlled commutating assembly

Atom probe tomography specimen preparation

Package structure and method of fabricating the same

Electric commutating ratchet tool

Payment method and system

Semiconductor device

Stator of a brushless motor

Automated balanced global clock tree synthesis in multi level physi...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

OPTICAL ELEMENT DRIVING MECHANISM

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OPERATING SYSTEM AND METHOD OF A FULLY HOMOMORPHIC ENCRYPTION NEURA...

INFERENCE AND CONVERSION METHOD FOR ENCRYPTED DEEP NEURAL NETWORK M...

Semiconductor Devices and Methods of Manufacturing

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

PACKAGE STRUCTURE

GREEN COFFEE BEAN IDENTIFICATION METHOD AND GREEN COFFEE BEAN IDENT...

OPTICAL ELEMENT DRIVING MECHANISM

ESTIMATION METHOD FOR STATE OF HEALTH OF BATTERY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

OPTICAL SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE

METHOD FOR ESTIMATING DIRECT CURRENT INTERNAL RESISTANCE OF BATTERY

LIQUID-CRYSTAL MEDIUM

CLOCK AND DATA RECOVERY CIRCUIT USING NEURAL NETWORK CIRCUIT TO OBT...

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SENSING DEVICE

WAFER AND METHOD OF PROCESSING WAFER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

OPTICAL ELEMENT DRIVING MECHANISM

REPLACEABLE FRAME ASSEMBLY FOR ACCOMMODATING EXPANSION CARD MODULE...