Shih-Tsun Huang

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Ground-enhanced semiconductor package and lead frame for the same
- Patent number 7,230,323
- Issue date Jun 12, 2007
- Siliconware Precision Industries Co., Ltd.
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ground-enhanced semiconductor package and lead frame for the same
- Publication number 20040238921
- Publication date Dec 2, 2004
- Silicon Precision Industries Co., Ltd
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS