Shih-Wei Tang

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
3D MIS-FO hybrid for embedded inductor package structure
- Patent number 12,205,750
- Issue date Jan 21, 2025
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single side modular 3D stack up SiP with mold cavity
- Patent number 11,621,218
- Issue date Apr 4, 2023
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information conveying method and system
- Patent number 9,692,932
- Issue date Jun 27, 2017
- Shih-Wei Tang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
3D MIS-FO Hybrid for Embedded Inductor Package Structure
- Publication number 20230170131
- Publication date Jun 1, 2023
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Information Conveying Method and System
- Publication number 20160044206
- Publication date Feb 11, 2016
- Shih-Wei Tang
- G06 - COMPUTING CALCULATING COUNTING