Shijian Li

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Waferless clean in dielectric etch process
- Patent number 10,147,587
- Issue date Dec 4, 2018
- Lam Research Corporation
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferless clean in dielectric etch process
- Patent number 9,824,865
- Issue date Nov 21, 2017
- Lam Research Corporation
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electroless metal deposition having filter system and...
- Patent number 9,752,231
- Issue date Sep 5, 2017
- Lam Research Corporation
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-deposition cleaning methods for substrates with cap layers
- Patent number 8,790,465
- Issue date Jul 29, 2014
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Methods and apparatuses for three dimensional integrated circuits
- Patent number 8,673,769
- Issue date Mar 18, 2014
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and solutions for preventing the formation of metal particu...
- Patent number 8,551,575
- Issue date Oct 8, 2013
- Lam Research
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device with post-contact back end of line through-hole via integration
- Patent number 8,519,461
- Issue date Aug 27, 2013
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-deposition cleaning methods and formulations for substrates wi...
- Patent number 8,404,626
- Issue date Mar 26, 2013
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Methods and systems for three-dimensional integrated circuit throug...
- Patent number 8,323,460
- Issue date Dec 4, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of post-contact back end of line through-hole via integration
- Patent number 8,187,968
- Issue date May 29, 2012
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma immersion ion implantation method using a pure or nearly pur...
- Patent number 8,168,519
- Issue date May 1, 2012
- Applied Materials, Inc.
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 8,053,355
- Issue date Nov 8, 2011
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods, apparatuses, and systems for fabricating three dimensional...
- Patent number 8,034,409
- Issue date Oct 11, 2011
- Lam Research Corporation
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single wafer dryer and drying methods
- Patent number 7,980,255
- Issue date Jul 19, 2011
- Applied Materials, Inc.
- Younes Achkire
- B08 - CLEANING
Information Patent Grant
Method for measuring dopant concentration during plasma ion implant...
- Patent number 7,977,199
- Issue date Jul 12, 2011
- Applied Materials, Inc.
- Majeed A. Foad
- G01 - MEASURING TESTING
Information Patent Grant
Plasma immersion ion implantation method using a pure or nearly pur...
- Patent number 7,968,439
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for low interfacial oxide contact between barri...
- Patent number 7,749,893
- Issue date Jul 6, 2010
- Lam Research Corporation
- Fritz Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma immersed ion implantation process
- Patent number 7,732,309
- Issue date Jun 8, 2010
- Applied Materials, Inc.
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring dopant concentration during plasma ion implant...
- Patent number 7,713,757
- Issue date May 11, 2010
- Applied Materials, Inc.
- Majeed A. Foad
- G01 - MEASURING TESTING
Information Patent Grant
Plasma immersion ion implantation with highly uniform chamber seaso...
- Patent number 7,691,755
- Issue date Apr 6, 2010
- Applied Materials, Inc.
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of post-contact back end of the line through-hole via integ...
- Patent number 7,615,480
- Issue date Nov 10, 2009
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wafer dryer and drying methods
- Patent number 7,513,062
- Issue date Apr 7, 2009
- Applied Materials, Inc.
- Younes Achkire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration damping during chemical mechanical polishing
- Patent number 7,497,767
- Issue date Mar 3, 2009
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Deposition chamber and method for depositing low dielectric constan...
- Patent number 7,413,627
- Issue date Aug 19, 2008
- Applied Materials, Inc.
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for chemical mechanical polishing of semicondu...
- Patent number 7,375,023
- Issue date May 20, 2008
- Applied Materials, Inc.
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Vibration damping in chemical mechanical polishing system
- Patent number 7,331,847
- Issue date Feb 19, 2008
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chemical mechanical polishing with high throughput and lo...
- Patent number 7,232,761
- Issue date Jun 19, 2007
- Applied Materials, Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Cu CMP polishing pad cleaning
- Patent number 7,220,322
- Issue date May 22, 2007
- Applied Materials, Inc.
- Lizhong Sun
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing a substrate having a filler layer and...
- Patent number 7,201,636
- Issue date Apr 10, 2007
- Applied Materials, Inc.
- Raymond R. Jin
- B24 - GRINDING POLISHING
Information Patent Grant
Planarized copper cleaning for reduced defects
- Patent number 7,104,267
- Issue date Sep 12, 2006
- Applied Materials Inc.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Corrosion-Resistant Temperature Sensor Probe
- Publication number 20190187003
- Publication date Jun 20, 2019
- LAM RESEARCH CORPORATION
- Justin Brunnett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFERLESS CLEAN IN DIELECTRIC ETCH PROCESS
- Publication number 20180005804
- Publication date Jan 4, 2018
- LAM RESEARCH CORPORATION
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTROLESS METAL DEPOSITION HAVING FILTER SYSTEM AND...
- Publication number 20170327952
- Publication date Nov 16, 2017
- LAM RESEARCH CORPORATION
- Shijian LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFERLESS CLEAN IN DIELECTRIC ETCH PROCESS
- Publication number 20150255259
- Publication date Sep 10, 2015
- LAM RESEARCH CORPORATION
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140145334
- Publication date May 29, 2014
- John BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20130323410
- Publication date Dec 5, 2013
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...
- Publication number 20130171820
- Publication date Jul 4, 2013
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20120205807
- Publication date Aug 16, 2012
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL INTEGRATE...
- Publication number 20120024230
- Publication date Feb 2, 2012
- Shijian LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...
- Publication number 20110259268
- Publication date Oct 27, 2011
- Majeed A. Foad
- G01 - MEASURING TESTING
Information Patent Application
PLASMA IMMERSION ION IMPLANTATION METHOD USING A PURE OR NEARLY PUR...
- Publication number 20110207307
- Publication date Aug 25, 2011
- Applied Materials, Inc.
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...
- Publication number 20110143553
- Publication date Jun 16, 2011
- LAM RESEARCH CORPORATION
- Yaxin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...
- Publication number 20100267229
- Publication date Oct 21, 2010
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...
- Publication number 20100216258
- Publication date Aug 26, 2010
- APPLIED MATERIALS, INC.
- Majeed A. Foad
- G01 - MEASURING TESTING
Information Patent Application
Methods and Solutions for Preventing the Formation of Metal Particu...
- Publication number 20100062164
- Publication date Mar 11, 2010
- LAM RESEARCH
- Shijian Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- Publication number 20100044867
- Publication date Feb 25, 2010
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER DRYER AND DRYING METHODS
- Publication number 20100006124
- Publication date Jan 14, 2010
- APPLIED MATERIALS, INC.
- Younes Achkire
- B08 - CLEANING
Information Patent Application
SINGLE WAFER DRYER AND DRYING METHODS
- Publication number 20090241996
- Publication date Oct 1, 2009
- Younes Achkire
- B08 - CLEANING
Information Patent Application
METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...
- Publication number 20090233384
- Publication date Sep 17, 2009
- Majeed A. Foad
- G01 - MEASURING TESTING
Information Patent Application
Plasma immersion ion implantation method using a pure or nearly pur...
- Publication number 20090197401
- Publication date Aug 6, 2009
- Applied Materials, Inc.
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20090162537
- Publication date Jun 25, 2009
- Artur KOLICS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of post-contact back end of line through-hole via integration
- Publication number 20080315418
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for three dimensional integrated circuits
- Publication number 20080315422
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and systems for three-dimensional integrated circuit throug...
- Publication number 20080314756
- Publication date Dec 25, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA IMMERSION ION IMPLANTATION WITH HIGHLY UNIFORM CHAMBER SEASO...
- Publication number 20080286982
- Publication date Nov 20, 2008
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, APPARATUSES, AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL...
- Publication number 20080152464
- Publication date Jun 26, 2008
- Shijian LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and systems for low interfacial oxide contact between barri...
- Publication number 20080142972
- Publication date Jun 19, 2008
- Fritz Redeker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLASMA IMMERSED ION IMPLANTATION PROCESS
- Publication number 20080138967
- Publication date Jun 12, 2008
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...
- Publication number 20080045021
- Publication date Feb 21, 2008
- Stan D. Tsai
- B24 - GRINDING POLISHING
Information Patent Application
SINGLE WAFER DRYER AND DRYING METHODS
- Publication number 20070295371
- Publication date Dec 27, 2007
- APPLIED MATERIALS, INC.
- Younes Achkire
- B08 - CLEANING

Person

Patents Grantslast 30 patents

Waferless clean in dielectric etch process

Waferless clean in dielectric etch process

Apparatus for electroless metal deposition having filter system and...

Post-deposition cleaning methods for substrates with cap layers

Methods and apparatuses for three dimensional integrated circuits

Methods and solutions for preventing the formation of metal particu...

Device with post-contact back end of line through-hole via integration

Post-deposition cleaning methods and formulations for substrates wi...

Methods and systems for three-dimensional integrated circuit throug...

Methods of post-contact back end of line through-hole via integration

Plasma immersion ion implantation method using a pure or nearly pur...

Methods and systems for low interfacial oxide contact between barri...

Methods, apparatuses, and systems for fabricating three dimensional...

Single wafer dryer and drying methods

Method for measuring dopant concentration during plasma ion implant...

Plasma immersion ion implantation method using a pure or nearly pur...

Methods and systems for low interfacial oxide contact between barri...

Plasma immersed ion implantation process

Method for measuring dopant concentration during plasma ion implant...

Plasma immersion ion implantation with highly uniform chamber seaso...

Methods of post-contact back end of the line through-hole via integ...

Single wafer dryer and drying methods

Vibration damping during chemical mechanical polishing

Deposition chamber and method for depositing low dielectric constan...

Method and apparatus for chemical mechanical polishing of semicondu...

Vibration damping in chemical mechanical polishing system

Method of chemical mechanical polishing with high throughput and lo...

Cu CMP polishing pad cleaning

Chemical mechanical polishing a substrate having a filler layer and...

Planarized copper cleaning for reduced defects

Patents Applicationslast 30 patents

Corrosion-Resistant Temperature Sensor Probe

WAFERLESS CLEAN IN DIELECTRIC ETCH PROCESS

APPARATUS FOR ELECTROLESS METAL DEPOSITION HAVING FILTER SYSTEM AND...

WAFERLESS CLEAN IN DIELECTRIC ETCH PROCESS

METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...

DEVICE WITH POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

APPARATUSES AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL INTEGRATE...

METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...

PLASMA IMMERSION ION IMPLANTATION METHOD USING A PURE OR NEARLY PUR...

INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURI...

METHODS AND SYSTEMS FOR LOW INTERFACIAL OXIDE CONTACT BETWEEN BARRI...

METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...

Methods and Solutions for Preventing the Formation of Metal Particu...

METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION

SINGLE WAFER DRYER AND DRYING METHODS

SINGLE WAFER DRYER AND DRYING METHODS

METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANT...

Plasma immersion ion implantation method using a pure or nearly pur...

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

Methods of post-contact back end of line through-hole via integration

Methods and apparatuses for three dimensional integrated circuits

Methods and systems for three-dimensional integrated circuit throug...

PLASMA IMMERSION ION IMPLANTATION WITH HIGHLY UNIFORM CHAMBER SEASO...

METHODS, APPARATUSES, AND SYSTEMS FOR FABRICATING THREE DIMENSIONAL...

Methods and systems for low interfacial oxide contact between barri...

PLASMA IMMERSED ION IMPLANTATION PROCESS

DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...

SINGLE WAFER DRYER AND DRYING METHODS