Shijian Luo

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 11,594,462
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tunable antenna using wire bonds
- Patent number 11,251,516
- Issue date Feb 15, 2022
- Micron Technology, Inc.
- Shijian Luo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,004,697
- Issue date May 11, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,763,131
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 10,748,857
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 10,741,468
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with direct electrical connections an...
- Patent number 10,679,921
- Issue date Jun 9, 2020
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,622,223
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 10,461,059
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 10,170,389
- Issue date Jan 1, 2019
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with direct electrical connections an...
- Patent number 10,134,655
- Issue date Nov 20, 2018
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with improved thermal management and...
- Patent number 9,899,293
- Issue date Feb 20, 2018
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with improved thermal management and...
- Patent number 9,543,274
- Issue date Jan 10, 2017
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 9,269,700
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with enhanced thermal management and s...
- Patent number 9,269,646
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including thermally insulating materi...
- Patent number 9,184,105
- Issue date Nov 10, 2015
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesives including a filler material and related methods
- Patent number 9,157,014
- Issue date Oct 13, 2015
- Micron Technology, Inc.
- Shijian Luo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 9,153,520
- Issue date Oct 6, 2015
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill-accommodating heat spreaders and related semiconductor de...
- Patent number 9,070,656
- Issue date Jun 30, 2015
- Micron Technology, Inc.
- Andy E. Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including thermally insulating materi...
- Patent number 8,816,494
- Issue date Aug 26, 2014
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry flux bonding device and method
- Patent number 8,492,242
- Issue date Jul 23, 2013
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density stacked die assemblies, structures incorporated therei...
- Patent number 8,072,055
- Issue date Dec 6, 2011
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Tunable Antenna Using Wire Bonds
- Publication number 20220140468
- Publication date May 5, 2022
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20220028820
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20210257226
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20210118852
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20200350224
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
- Publication number 20200258859
- Publication date Aug 13, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200083178
- Publication date Mar 12, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Tunable Antenna Using Wire Bonds
- Publication number 20200076051
- Publication date Mar 5, 2020
- Micron Technology, Inc.
- Shijian Luo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Carrier Bond and Debond Using Self-Depolymerizing Polymer
- Publication number 20200075384
- Publication date Mar 5, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190311918
- Publication date Oct 10, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157112
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157111
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20190122950
- Publication date Apr 25, 2019
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH DIRECT ELECTRICAL CONNECTIONS AN...
- Publication number 20190051578
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH DIRECT ELECTRICAL CONNECTIONS AN...
- Publication number 20180158751
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20180033781
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND...
- Publication number 20170117205
- Publication date Apr 27, 2017
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20160358898
- Publication date Dec 8, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND...
- Publication number 20160218085
- Publication date Jul 28, 2016
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20160141270
- Publication date May 19, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20150279828
- Publication date Oct 1, 2015
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL-ACCOMMODATING HEAT SPREADERS AND RELATED SEMICONDUCTOR DE...
- Publication number 20140367844
- Publication date Dec 18, 2014
- Andy E. Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERI...
- Publication number 20140327130
- Publication date Nov 6, 2014
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVES INCLUDING A FILLER MATERIAL AND RELATED METHODS
- Publication number 20140147989
- Publication date May 29, 2014
- Micron Technology, Inc.
- Shijian Luo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERI...
- Publication number 20140015598
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Steven Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FLUX BONDING DEVICE AND METHOD
- Publication number 20130299868
- Publication date Nov 14, 2013
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS

Shijian Luo

Person

Patents Grantslast 30 patents

Methods of forming microelectronic device assemblies and packages

Use of pre-channeled materials for anisotropic conductors

Semiconductor device with a multi-layered encapsulant and associate...

Stacked semiconductor die assemblies with multiple thermal paths an...

Microelectronic device assemblies and packages and related methods...

Die features for self-alignment during die bonding

Semiconductor device with tunable antenna using wire bonds

Use of pre-channeled materials for anisotropic conductors

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor device with a multi-layered encapsulant and associate...

Die features for self-alignment during die bonding

Stacked semiconductor die assemblies with multiple thermal paths an...

Semiconductor device packages with direct electrical connections an...

Semiconductor device with a multi-layered encapsulant and associate...

Stacked semiconductor die assemblies with improved thermal performa...

Stacked semiconductor die assemblies with multiple thermal paths an...

Semiconductor device packages with direct electrical connections an...

Methods of manufacturing multi-die semiconductor device packages an...

Semiconductor device packages with improved thermal management and...

Methods of manufacturing multi-die semiconductor device packages an...

Semiconductor device packages with improved thermal management and...

Stacked semiconductor die assemblies with improved thermal performa...

Semiconductor die assemblies with enhanced thermal management and s...

Semiconductor device packages including thermally insulating materi...

Adhesives including a filler material and related methods

Stacked semiconductor die assemblies with multiple thermal paths an...

Underfill-accommodating heat spreaders and related semiconductor de...

Semiconductor device packages including thermally insulating materi...

Dry flux bonding device and method

High density stacked die assemblies, structures incorporated therei...

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

Semiconductor Device with Tunable Antenna Using Wire Bonds

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

Die Features for Self-Alignment During Die Bonding

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...

Use of Pre-Channeled Materials for Anisotropic Conductors

Die Features for Self-Alignment During Die Bonding

Semiconductor Device with Tunable Antenna Using Wire Bonds

Carrier Bond and Debond Using Self-Depolymerizing Polymer

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...

SEMICONDUCTOR DEVICE PACKAGES WITH DIRECT ELECTRICAL CONNECTIONS AN...

SEMICONDUCTOR DEVICE PACKAGES WITH DIRECT ELECTRICAL CONNECTIONS AN...

METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND...

METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

UNDERFILL-ACCOMMODATING HEAT SPREADERS AND RELATED SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERI...

TEMPORARY ADHESIVES INCLUDING A FILLER MATERIAL AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERI...

DRY FLUX BONDING DEVICE AND METHOD