Shijo NAGAO

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Suita-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate evaluation chip and substrate evaluation device
- Patent number 11,454,601
- Issue date Sep 27, 2022
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material, method for producing bonding material, and method...
- Patent number 11,273,525
- Issue date Mar 15, 2022
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding device
- Patent number 11,049,840
- Issue date Jun 29, 2021
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE EVALUATION CHIP AND SUBSTRATE EVALUATION DEVICE
- Publication number 20200378912
- Publication date Dec 3, 2020
- OSAKA UNIVERSITY
- Katsuaki Suganuma
- G01 - MEASURING TESTING
Information Patent Application
BONDING DEVICE
- Publication number 20190189587
- Publication date Jun 20, 2019
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND METHOD...
- Publication number 20190047093
- Publication date Feb 14, 2019
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE
- Publication number 20170170137
- Publication date Jun 15, 2017
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS