Shiki Ueki

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing multilayer substrate and desmearing method
- Patent number 8,898,895
- Issue date Dec 2, 2014
- FUJIFILM Corporation
- Shiki Ueki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substance-adsorbing resin film, method for producing con...
- Patent number 8,076,264
- Issue date Dec 13, 2011
- FUJIFILM Corporation
- Mitsuyuki Tsurumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING MULTILAYER SUBSTRATE AND DESMEARING METHOD
- Publication number 20130326874
- Publication date Dec 12, 2013
- FUJIFILM CORPORATION
- Shiki UEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF
- Publication number 20100273014
- Publication date Oct 28, 2010
- FUJIFILM Corporation
- Shiki Ueki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL LAYER LAMINATE HAVING ROUGHENED METAL SURFACE LAYER AND METHO...
- Publication number 20100190029
- Publication date Jul 29, 2010
- FUJIFILM Corporation
- Shiki Ueki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CON...
- Publication number 20100113264
- Publication date May 6, 2010
- FUJIFILM Corporation
- Mitsuyuki Tsurumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR