Shimon Neftin

Person

Kiryat Shmonah, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Device for electronic packaging, pin jig fixture
- Patent number 6,670,704
- Issue date Dec 30, 2003
- Micro Components Ltd.
- Shimon Neftin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electronic packaging, pin jig fixture
- Patent number 6,448,510
- Issue date Sep 10, 2002
- Micro Components Ltd.
- Shimon Neftin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES
- Publication number 20120273963
- Publication date Nov 1, 2012
- Uri Mirsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES
- Publication number 20120112238
- Publication date May 10, 2012
- MICRO COMPONENTS LTD.
- Uri Mirsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATES, METHODS AND SYSTEMS THEREOF
- Publication number 20100252306
- Publication date Oct 7, 2010
- Micro Components Ltd.
- Uri Mirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEEP ANODIZATION
- Publication number 20100255274
- Publication date Oct 7, 2010
- Uri Mirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OPTICALLY MONITORING AN ALOX FABRICATION PROCESS
- Publication number 20100078329
- Publication date Apr 1, 2010
- Uri Mirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Microelectronic packaging and components
- Publication number 20070126111
- Publication date Jun 7, 2007
- Uri Mirsky
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic packaging and components
- Publication number 20060057866
- Publication date Mar 16, 2006
- Uri Mirsky
- G01 - MEASURING TESTING

Shimon Neftin

Person

Patents Grantslast 30 patents

Device for electronic packaging, pin jig fixture

Substrate for electronic packaging, pin jig fixture

Patents Applicationslast 30 patents

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

INTERCONNECT SUBSTRATES, METHODS AND SYSTEMS THEREOF

DEEP ANODIZATION

OPTICALLY MONITORING AN ALOX FABRICATION PROCESS

Microelectronic packaging and components

Microelectronic packaging and components