Shimon OSADA

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
- Publication number 20220064788
- Publication date Mar 3, 2022
- SHOWA DENKO K.K.
- Yosuke TANIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
- Publication number 20220064777
- Publication date Mar 3, 2022
- SHOWA DENKO K.K.
- Yosuke TANIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
- Publication number 20220059327
- Publication date Feb 24, 2022
- SHOWA DENKO K.K.
- Yosuke TANIMOTO
- H01 - BASIC ELECTRIC ELEMENTS