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Shimon PODVAL

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  • Rishon LeZion, IL
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor die and package jigsaw submount
    • Patent number 9,831,144
    • Issue date Nov 28, 2017
    • QUBEICON LTD.
    • Shimon Podval
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    IC package and assembly
    • Patent number 9,101,058
    • Issue date Aug 4, 2015
    • Marvell World Trade Ltd.
    • Shimon Podval
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT
    • Publication number 20160163610
    • Publication date Jun 9, 2016
    • QUBEICON LTD.
    • Shimon Podval
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGE AND ASSEMBLY
    • Publication number 20140022736
    • Publication date Jan 23, 2014
    • Shimon PODVAL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR