Shin-Dar Jan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Optical image capturing module and method of manufacturing the same...
- Patent number 9,158,089
- Issue date Oct 13, 2015
- Lite-On Technology Corporation
- Shin-Dar Jan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Image sensor module having flat material between circuit board and...
- Patent number 9,161,449
- Issue date Oct 13, 2015
- Lite-On Technology Corporation
- Shin-Dar Jan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image capturing module for reducing assembly tilt angle
- Patent number 9,154,675
- Issue date Oct 6, 2015
- Lite-On Technology Corporation
- Shin-Dar Jan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of aligning and assembling an image capturing module
- Patent number 9,128,223
- Issue date Sep 8, 2015
- Lite-On Technology Corporation
- Shin-Dar Jan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate inside type module structure
- Patent number 8,901,693
- Issue date Dec 2, 2014
- Lite-On Technology Corporation
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module structure for particles protection
- Patent number 8,872,296
- Issue date Oct 28, 2014
- Lite-On Technology Corporation
- Shin-Dar Jan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Holder on chip module structure
- Patent number 8,866,246
- Issue date Oct 21, 2014
- LarView Technologies Corporation
- Shin-Dar Jan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module structure with partial pierced substrate
- Patent number 8,816,414
- Issue date Aug 26, 2014
- LarView Technologies Corporation
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate connection type module structure
- Patent number 8,809,984
- Issue date Aug 19, 2014
- LarView Technologies Corporation
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME...
- Publication number 20150198780
- Publication date Jul 16, 2015
- LARVIEW TECHNOLOGIES CORP.
- Shin-Dar Jan
- B32 - LAYERED PRODUCTS
Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20150116954
- Publication date Apr 30, 2015
- LARVIEW TECHNOLOGIES CORP.
- SHIN-DAR JAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE CAPTURING MODULE AND METHOD OF ALIGNING AND ASSEMBLING THE SAME
- Publication number 20150116580
- Publication date Apr 30, 2015
- LARVIEW TECHNOLOGIES CORP.
- SHIN-DAR JAN
- G02 - OPTICS
Information Patent Application
IMAGE CAPTURING MODULE FOR REDUCING ASSEMBLY TILT ANGLE
- Publication number 20150116589
- Publication date Apr 30, 2015
- LARVIEW TECHNOLOGIES CORP.
- SHIN-DAR JAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Module Structure with Partial Pierced Substrate
- Publication number 20140124887
- Publication date May 8, 2014
- LarView Technologies Corporation
- Shin-Dar JAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Module Structure for Particles Protection
- Publication number 20140117479
- Publication date May 1, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HOLDER ON CHIP MODULE STRUCTURE
- Publication number 20140117480
- Publication date May 1, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Type Camera Module Structure
- Publication number 20140035079
- Publication date Feb 6, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Connection Type Module Structure
- Publication number 20140035078
- Publication date Feb 6, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Inside Type Module Structure
- Publication number 20140035081
- Publication date Feb 6, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pierced Substrate on Chip Module Structure
- Publication number 20140035165
- Publication date Feb 6, 2014
- LARVIEW TECHNOLOGIES CORPORATION
- Shin-Dar Jan
- H01 - BASIC ELECTRIC ELEMENTS

Shin-Dar Jan

Person

Patents Grantslast 30 patents

Optical image capturing module and method of manufacturing the same...

Image sensor module having flat material between circuit board and...

Image capturing module for reducing assembly tilt angle

Method of aligning and assembling an image capturing module

Substrate inside type module structure

Chip module structure for particles protection

Holder on chip module structure

Module structure with partial pierced substrate

Substrate connection type module structure

Patents Applicationslast 30 patents

OPTICAL IMAGE CAPTURING MODULE AND METHOD OF MANUFACTURING THE SAME...

IMAGE SENSOR MODULE

IMAGE CAPTURING MODULE AND METHOD OF ALIGNING AND ASSEMBLING THE SAME

IMAGE CAPTURING MODULE FOR REDUCING ASSEMBLY TILT ANGLE

Module Structure with Partial Pierced Substrate

Chip Module Structure for Particles Protection

HOLDER ON CHIP MODULE STRUCTURE

Window Type Camera Module Structure

Substrate Connection Type Module Structure

Substrate Inside Type Module Structure

Pierced Substrate on Chip Module Structure