Shin Fukuda

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin copper foil with carrier and printed wiring board using...
- Patent number 7,790,269
- Issue date Sep 7, 2010
- The Furukawa Electric Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultra-fine printed wiring board
- Patent number 7,175,920
- Issue date Feb 13, 2007
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high-density ultrafine printed wiring boad
- Patent number 7,026,059
- Issue date Apr 11, 2006
- Circuit Foil Japan Co., Ltd.
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 6,835,442
- Issue date Dec 28, 2004
- Sony Chemicals Corp.
- Noriaki Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING...
- Publication number 20090011271
- Publication date Jan 8, 2009
- Akitoshi SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultra-fine printed wiring board
- Publication number 20050249927
- Publication date Nov 10, 2005
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultra-thin copper foil with carrier and printed wiring board using...
- Publication number 20050158574
- Publication date Jul 21, 2005
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high-density ultrafine printed wiring boad
- Publication number 20040038049
- Publication date Feb 26, 2004
- CIRCUIT FOIL JAPAN CO., LTD.
- Akitoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible printed wiring board
- Publication number 20030132192
- Publication date Jul 17, 2003
- Noriaki Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR