TREA

Shin Hirano

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  • Kawasaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of producing substrate
    • Patent number 8,186,052
    • Issue date May 29, 2012
    • Fujitsu Limited
    • Kenji Iida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate including conductive core substrate, and manufactu...
    • Patent number 8,178,791
    • Issue date May 15, 2012
    • Fujitsu Limited
    • Tomoyuki Abe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and method of producing the same
    • Patent number 8,153,908
    • Issue date Apr 10, 2012
    • Fujitsu Limited
    • Kenji Iida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of producing substrate
    • Patent number 8,151,456
    • Issue date Apr 10, 2012
    • Fujitsu Limited
    • Yasutomo Maehara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board
    • Patent number 8,119,923
    • Issue date Feb 21, 2012
    • Fujitsu Limited
    • Hideaki Yoshimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Core substrate and printed wiring board
    • Patent number 8,119,925
    • Issue date Feb 21, 2012
    • Fujitsu Limited
    • Hideaki Yoshimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 8,110,749
    • Issue date Feb 7, 2012
    • Fujitsu Limited
    • Hideaki Yoshimura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Core substrate and method of producing the same
    • Patent number 8,035,037
    • Issue date Oct 11, 2011
    • Fujitsu Limited
    • Kenji Iida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents