Shin-ichi Yamagata

Person

Itami-shi, Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor heat-dissipating substrate, and manufacturing method...
- Patent number 7,180,178
- Issue date Feb 20, 2007
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor heat-dissipating substrate, and manufacturing method...
- Patent number 6,979,901
- Issue date Dec 27, 2005
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member for semiconductor device and method for producing the same
- Patent number 6,507,105
- Issue date Jan 14, 2003
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Silicon carbide based composite material and manufacturing method t...
- Patent number 6,280,496
- Issue date Aug 28, 2001
- Sumitomo Electric Industries, Ltd.
- Chihiro Kawai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum base member for semiconductor device containing a nitrogen...
- Patent number 6,123,895
- Issue date Sep 26, 2000
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor substate with improved thermal conductivity
- Patent number 5,828,127
- Issue date Oct 27, 1998
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Nitrogenous aluminum-silicon powder metallurgical alloy
- Patent number 5,605,558
- Issue date Feb 25, 1997
- Sumitomo Electric Industries, Ltd.
- Shin-ichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Apparatus for producing a silicon nitride sintered body
- Patent number 5,533,930
- Issue date Jul 9, 1996
- Sumitomo Electric Industries, Ltd.
- Yasushi Tsuzuki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...
- Publication number 20240304514
- Publication date Sep 12, 2024
- Sumitomo Electric Industries, Ltd.
- Toru MAEDA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
- Publication number 20230352363
- Publication date Nov 2, 2023
- Sumitomo Electric Industries, Ltd.
- Toru MAEDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat spreader and method for manufacturing the same, and semiconduc...
- Publication number 20080298024
- Publication date Dec 4, 2008
- A.L.M.T. CORP.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Heat-Dissipating Substrate, and Manufacturing Method...
- Publication number 20050230819
- Publication date Oct 20, 2005
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Semicoductor radiating substrate and production method therefor and...
- Publication number 20040135247
- Publication date Jul 15, 2004
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY

Shin-ichi Yamagata

Person

Patents Grantslast 30 patents

Semiconductor heat-dissipating substrate, and manufacturing method...

Semiconductor heat-dissipating substrate, and manufacturing method...

Member for semiconductor device and method for producing the same

Silicon carbide based composite material and manufacturing method t...

Aluminum base member for semiconductor device containing a nitrogen...

Semiconductor substate with improved thermal conductivity

Nitrogenous aluminum-silicon powder metallurgical alloy

Apparatus for producing a silicon nitride sintered body

Patents Applicationslast 30 patents

COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...

COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE

Heat spreader and method for manufacturing the same, and semiconduc...

Semiconductor Heat-Dissipating Substrate, and Manufacturing Method...

Semicoductor radiating substrate and production method therefor and...