Shin Matsuda

Follow

Person

Kokubu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package for a semiconductor element having depressions containing s...
- Patent number 6,225,700
- Issue date May 1, 2001
- Kyocera Corporation
- Nobuyuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package for housing semiconductor element
- Patent number 5,918,796
- Issue date Jul 6, 1999
- Kyocera Corporation
- Shin Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for housing semiconductor elements
- Patent number 5,512,786
- Issue date Apr 30, 1996
- Kyocera Corporation
- Hitomi Imamura
- H01 - BASIC ELECTRIC ELEMENTS