Shin-Puu Jeng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,154,888
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit packages and methods of formin...
- Patent number 12,154,896
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,148,684
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device package having dummy...
- Patent number 12,125,822
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method forming same
- Patent number 12,125,833
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with cavity in interposer
- Patent number 12,125,755
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,113,006
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing package using reinforcing patches
- Patent number 12,094,810
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,094,828
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,087,705
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with ring-shaped substrates
- Patent number 12,074,104
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with thermal management features
- Patent number 12,074,083
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,074,101
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure and method for formin...
- Patent number 12,068,260
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,057,424
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,051,654
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD
- Publication number 20240387339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING DAM
- Publication number 20240387195
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES
- Publication number 20240387341
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH INTEGRATED PASSIVE DEVICES AND METHODS O...
- Publication number 20240387378
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240387405
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20240379648
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379646
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...
- Publication number 20240379494
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371742
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20240371829
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20240371792
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME
- Publication number 20240371843
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20240363551
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363517
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Shin-Puu Jeng

Person

Patents Grantslast 30 patents

Semiconductor die package with multi-lid structures and method for...

Semiconductor packages and methods of forming same

Semiconductor devices and methods of manufacturing

Semiconductor package and methods of manufacturing

Semiconductor package and method of manufacturing the same

Three-dimensional integrated circuit packages and methods of formin...

Package structure and method

Method for fabricating semiconductor package

Heterogeneous fan-out structure and method of manufacture

Method of manufacturing a semiconductor device package having dummy...

Integrated circuit package and method forming same

Chip package structure with cavity in interposer

Encircling a semiconductor device with stacked frames on a substrate

Semiconductor package

Semiconductor package with dual sides of metal routing

Chip package structure

Method for forming chip package structure

Semiconductor device with curved conductive lines and method of for...

Reinforcing package using reinforcing patches

Method for forming package structure

Eccentric via structures for stress reduction

Package structure with warpage-control element

Integrated circuit packages with ring-shaped substrates

Semiconductor die package with thermal management features

Package structure and method of fabricating the same

Semiconductor die package with ring structure and method for formin...

Package structure and method for forming the same

Chip package structure with multiple gap-filling layers and fabrica...

Package structure and method of fabricating the same

Chip package with redistribution structure having multiple chips

Patents Applicationslast 30 patents

DIE STRUCTURES AND METHODS OF FORMING THE SAME

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

PACKAGE STRUCTURE AND METHOD

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

CHIP PACKAGE STRUCTURE WITH RING DAM

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES

SEMICONDUCTOR DEVICES WITH INTEGRATED PASSIVE DEVICES AND METHODS O...

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

Hybrid organic and non-organic interposer with embedded component a...

Semiconductor Devices and Methods of Manufacturing

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...

SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMIN...

METHOD OF FABRICATING PACKAGE STRUCTURE