Shin-Puu Jeng

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low dielectric constant film produced from silicon compounds compri...
- Patent number 7,651,725
- Issue date Jan 26, 2010
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 7,560,377
- Issue date Jul 14, 2009
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low dielectric constant film produced from silicon compounds compri...
- Patent number 7,023,092
- Issue date Apr 4, 2006
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,930,061
- Issue date Aug 16, 2005
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,869,896
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low dielectric with organo silane
- Patent number 6,770,556
- Issue date Aug 3, 2004
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,734,115
- Issue date May 11, 2004
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low K dielectric with organo silane
- Patent number 6,730,593
- Issue date May 4, 2004
- Applied Materials Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,562,690
- Issue date May 13, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,541,282
- Issue date Apr 1, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric with organo silane
- Patent number 6,511,903
- Issue date Jan 28, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low K dielectric with organo silane
- Patent number 6,511,909
- Issue date Jan 28, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,303,523
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low power method of depositing a low k dielectric with organo silane
- Patent number 6,072,227
- Issue date Jun 6, 2000
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric with organo silane
- Patent number 6,054,379
- Issue date Apr 25, 2000
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080064225
- Publication date Mar 13, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080061439
- Publication date Mar 13, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...
- Publication number 20080044557
- Publication date Feb 21, 2008
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20050191846
- Publication date Sep 1, 2005
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20050156317
- Publication date Jul 21, 2005
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20040201103
- Publication date Oct 14, 2004
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low dielectric constant film produced from silicon compounds compri...
- Publication number 20040147109
- Publication date Jul 29, 2004
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040082199
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040038545
- Publication date Feb 26, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low dielectric with organo silane
- Publication number 20030113992
- Publication date Jun 19, 2003
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20030064610
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low K dielectric with organo silane
- Publication number 20020111042
- Publication date Aug 15, 2002
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMP...
- Publication number 20020000670
- Publication date Jan 3, 2002
- WAI-FAN YAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010005546
- Publication date Jun 28, 2001
- APPLIED MATERIALS, INC.
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010004479
- Publication date Jun 21, 2001
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Shin-Puu Jeng

Person

Patents Grantslast 30 patents

Low dielectric constant film produced from silicon compounds compri...

Plasma processes for depositing low dielectric constant films

Low dielectric constant film produced from silicon compounds compri...

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing a low dielectric with organo silane

Plasma processes for depositing low dielectric constant films

Method of depositing a low K dielectric with organo silane

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing a low k dielectric with organo silane

Method of depositing a low K dielectric with organo silane

Plasma processes for depositing low dielectric constant films

Low power method of depositing a low k dielectric with organo silane

Method of depositing a low k dielectric with organo silane

Patents Applicationslast 30 patents

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMPRI...

Plasma processes for depositing low dielectric constant films

Low dielectric constant film produced from silicon compounds compri...

Low dielectric constant film produced from silicon compounds compri...

Low dielectric constant film produced from silicon compounds compri...

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing a low dielectric with organo silane

Plasma processes for depositing low dielectric constant films

Method of depositing a low K dielectric with organo silane

A LOW DIELECTRIC CONSTANT FILM PRODUCED FROM SILICON COMPOUNDS COMP...

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS