Shin-Shyan Hsieh

Person

  • Kao-Hsiung Shih, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Flip-chip package and fabricating process thereof

    • Publication number 20040164426
    • Publication date Aug 26, 2004
    • Tsung-Ming Pai
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Mold for an integrated circuit package

    • Publication number 20030129272
    • Publication date Jul 10, 2003
    • Chi-Chih Shen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL