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Shin-Shyan Hsieh
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Kao-Hsiung Shih, TW
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Patents Grants
last 30 patents
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Patent Grant
Flip-chip package and fabricating process thereof
Patent number
7,052,935
Issue date
May 30, 2006
Advanced Semiconductor Engineering, Inc.
Tsung-Ming Pai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Flip-chip package and fabricating process thereof
Publication number
20040164426
Publication date
Aug 26, 2004
Tsung-Ming Pai
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Mold for an integrated circuit package
Publication number
20030129272
Publication date
Jul 10, 2003
Chi-Chih Shen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL